LPC2364HBD100 NXP Semiconductors, LPC2364HBD100 Datasheet - Page 52

• Manufacturer Part Number: LPC2364HBD100
• Description: LPC2364HBD100/LQFP100/TRAYBDP/
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2364HBD100

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 34K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 100-LQFP
• Processor Series: LPC23
• Core: ARM7TDMI-S
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, SAB-TFBGA100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

NXP Semiconductors
14. Package outline
Fig 19. Package outline SOT407-1 (LQFP100)
LPC2364_65_66_67_68_6
Product data sheet
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT407-1
100
76
max.
1.6
75
A
y
1
0.15
0.05
A
1
e
pin 1 index
1.45
1.35
A
2
136E20
IEC
0.25
b
A
p
3
H
D
D
0.27
0.17
b
w
p
M
0.20
0.09
c
MS-026
JEDEC
Z D
14.1
13.9
D
X
(1)
0
REFERENCES
25
Rev. 06 — 1 February 2010
51
14.1
13.9
E
(1)
26
50
Z E
0.5
e
b
B
e
w
p
JEITA
v
v
scale
M
16.25
15.75
H
M
5
M
D
A
E
A
B
16.25
15.75
H
H
E
E
L
1
10 mm
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
A
0.75
0.45
L
A
p
2
A
0.2
1
v
0.08
w
PROJECTION
EUROPEAN
detail X
0.08
y
Z
1.15
0.85
D
(1)
L
© NXP B.V. 2010. All rights reserved.
Z
L
1.15
0.85
E
p
ISSUE DATE
(1)
00-02-01
03-02-20
(A )
7
0
θ
3
o
o
SOT407-1
θ
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