MAC997B8 ON Semiconductor, MAC997B8 Datasheet - Page 7

• Manufacturer Part Number: MAC997B8
• Description: Triacs THY .8A 600V TRIAC
• Manufacturer: ON Semiconductor

Specifications of MAC997B8

• Rated Repetitive Off-state Voltage Vdrm: 600 V
• Breakover Current Ibo Max: 8 A
• Off-state Leakage Current @ Vdrm Idrm: 0.01 mA
• Gate Trigger Voltage (vgt): 2.5 V
• Gate Trigger Current (igt): 5 mA
• Holding Current (ih Max): 10 mA
• Forward Voltage Drop: 1.9 V @ 85 A
• Mounting Style: Through Hole
• Package / Case: TO-92-3 (TO-226)
• Repetitive Peak Forward Blocking Voltage: 600 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NOTES:
1. Maximum alignment deviation between leads not to be greater than 0.2 mm.
2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
3. Component lead to tape adhesion must meet the pull test requirements.
4. Maximum non−cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
6. No more than 1 consecutive missing component is permitted.
7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
8. Splices will not interfere with the sprocket feed holes.
Symbol
F1, F2
H2A
H2B
W1
W2
D2
H1
H4
H5
P1
P2
T1
T2
L1
W
D
H
P
T
L
Tape Feedhole Diameter
Component Lead Thickness Dimension
Component Lead Pitch
Bottom of Component to Seating Plane
Feedhole Location
Deflection Left or Right
Deflection Front or Rear
Feedhole to Bottom of Component
Feedhole to Seating Plane
Defective Unit Clipped Dimension
Lead Wire Enclosure
Feedhole Pitch
Feedhole Center to Center Lead
First Lead Spacing Dimension
Adhesive Tape Thickness
Overall Taped Package Thickness
Carrier Strip Thickness
Carrier Strip Width
Adhesive Tape Width
Adhesive Tape Position
H4 H5
TO−92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
H
H2A
P2
P1
Figure 12. Device Positioning on Tape
F1
P
F2
Item
H2A
P2
http://onsemi.com
7
L
D
W2
L1
H1
W1
W
0.09842
0.1496
0.0945
0.3346
0.7086
0.3346
0.4921
0.2342
0.1397
0.6889
0.2165
0.015
0.610
0.014
.0059
Min
.059
0.06
—
0
0
T1
Inches
T
H2B
0.01968
0.1653
0.3741
0.5079
0.2658
0.1556
0.0567
0.7481
0.2841
0.020
0.110
0.039
0.051
0.768
0.649
0.433
0.027
Max
.156
0.08
Specification
—
H2B
T2
Min
0.38
15.5
12.5
5.95
3.55
0.15
0.35
17.5
3.8
2.4
1.5
8.5
8.5
2.5
5.5
.15
18
—
0
0
Millimeter
Max
0.51
19.5
16.5
12.9
6.75
3.95
0.20
1.44
0.65
4.2
2.8
4.0
9.5
1.0
1.0
6.3
0.5
11
19
—