STTH1002CFP STMicroelectronics, STTH1002CFP Datasheet - Page 4

DIODE FAST 200V 8A TO-220FPAB

STTH1002CFP

Manufacturer Part Number
STTH1002CFP
Description
DIODE FAST 200V 8A TO-220FPAB
Manufacturer
STMicroelectronics
Datasheet

Specifications of STTH1002CFP

Voltage - Forward (vf) (max) @ If
1.1V @ 5A
Current - Reverse Leakage @ Vr
5µA @ 200V
Current - Average Rectified (io) (per Diode)
8A
Voltage - Dc Reverse (vr) (max)
200V
Reverse Recovery Time (trr)
25ns
Diode Type
Standard
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Diode Configuration
1 Pair Common Cathode
Mounting Type
Through Hole
Package / Case
TO-220-3 Full Pack (Straight Leads)
Product
Ultra Fast Recovery Rectifier
Configuration
Dual Common Cathode
Reverse Voltage
200 V
Forward Voltage Drop
1.25 V at 10 A
Recovery Time
25 ns
Forward Continuous Current
8 A
Max Surge Current
50 A
Reverse Current Ir
5 uA
Mounting Style
Through Hole
Maximum Operating Temperature
+ 175 C
Minimum Operating Temperature
- 65 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-3537-5

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STTH1002CFP
Manufacturer:
STMicroelectronics
Quantity:
4 000
Part Number:
STTH1002CFP
Manufacturer:
FSC
Quantity:
5 000
Part Number:
STTH1002CFP
Manufacturer:
ST
0
Part Number:
STTH1002CFP
Manufacturer:
ST
Quantity:
200
Part Number:
STTH1002CFP
Manufacturer:
ST
Quantity:
20 000
Company:
Part Number:
STTH1002CFP
Quantity:
5 000
Company:
Part Number:
STTH1002CFP
Quantity:
40 000
Part Number:
STTH1002CFP@@@@
Manufacturer:
ST
0
STTH1002C
Fig. 5: Reverse recovery charges versus dI
(typical values, per diode).
240
220
200
180
160
140
120
100
Fig. 7: Peak reverse recovery current versus dI
(typical values, per diode).
13
12
11
10
Fig. 9-1: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, e
80
70
60
50
40
30
20
10
4/8
80
60
40
20
9
8
7
6
5
4
3
2
1
0
0
0
10
0
I
R
10
RM
Q (nC)
th(j-a)
I =5A
V =160V
F
rr
R
I =5A
V =160V
(A)
F
R
2
(°C/W)
4
6
CU
S(Cu)(cm²)
dI /dt(A/µs)
8
dI /dt(A/µs)
: 35µm) for D
F
T =125°C
j
F
100
T =125°C
100
10
j
12
14
T =25°C
2
j
PAK.
T =25°C
j
16
18
F
F
1000
1000
/dt
/dt
20
Fig. 6: Reverse recovery time versus dI
(typical values, per diode).
80
70
60
50
40
30
20
10
Fig. 8:
temperature.
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Fig. 9-2: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, e
100
0
90
80
70
60
50
40
30
20
10
0
10
25
t (ns)
Q ;
0
R
rr
I =5A
V =160V
I =5A
V =160V
F
rr
F
th(j-a)
R
R
I
RM
2
(°C/W)
[T ]/Q ;I
j
Dynamic parameters versus junction
50
4
rr RM
6
[T =125°C]
I
RM
j
CU
75
S(Cu)(cm²)
dI /dt(A/µs)
8
T =125°C
: 35µm) for DPAK.
F
j
Q
rr
T (°C)
100
j
10
T =25°C
100
j
12
14
125
16
18
F
1000
/dt
150
20

Related parts for STTH1002CFP