TISPPBL1P-S Bourns Inc., TISPPBL1P-S Datasheet - Page 16

• Manufacturer Part Number: TISPPBL1P-S
• Description: Sidacs
• Manufacturer: Bourns Inc.

Specifications of TISPPBL1P-S

• Mounting Style: Through Hole
• Package / Case: PDIP-8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

TISPPBL1D, TISPPBL1P, TISPPBL2D, TISPPBL2P
DUAL FORWARD-CONDUCTING P-GATE THYRISTORS
FOR ERICSSON COMPONENTS SLICS
D008
plastic small-outline package
NOTES: A. Leads are within 0,25 (0.010) radius of true position at maximum material condition.
16
D008
6,20 (0.244)
5,80 (0.228)
1,75 (0.069)
1,35 (0.053)
This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
B. Body dimensions do not include mold flash or protrusion.
C. Mold flash or protrusion shall not exceed 0,15 (0.006).
D. Lead tips to be planar within ±0,051 (0.002).
0,203 (0.008)
0,102 (0.004)
0,79 (0.031)
0,28 (0.011)
4,00 (0.157)
3,81 (0.150)
INDEX
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
1
8
7° NOM
3 Places
5,00 (0.197)
4,80 (0.189)
2
7
Pin Spacing
(see Note A)
1,27 (0.050)
6 Places
6
3
MECHANICAL DATA
0,50 (0.020)
0,25 (0.010)
0,51 (0.020)
0,36 (0.014)
5
4
8 Places
x 45°NOM
0,229 (0.0090)
0,190 (0.0075)
P R O D U C T
8-pin Small Outline Microelectronic Standard
Specifications are subject to change without notice.
Package MS-012, JEDEC Publication 95
7° NOM
4 Places
5,21 (0.205)
4,60 (0.181)
AUGUST 1997 - REVISED AUGUST 2002
1,12 (0.044)
0,51 (0.020)
I N F O R M A T I O N
4° ± 4°
MDXXAAC