PMEG2005EL T/R NXP Semiconductors, PMEG2005EL T/R Datasheet

Schottky (Diodes & Rectifiers) DIODE SCHTTKY TAPE-7

PMEG2005EL T/R

Manufacturer Part Number
PMEG2005EL T/R
Description
Schottky (Diodes & Rectifiers) DIODE SCHTTKY TAPE-7
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PMEG2005EL T/R

Product
Schottky Diodes
Peak Reverse Voltage
20 V
Forward Continuous Current
0.5 A
Max Surge Current
3 A
Configuration
Single
Forward Voltage Drop
0.5 V
Maximum Reverse Leakage Current
30 uA
Operating Temperature Range
+ 150 C
Mounting Style
SMD/SMT
Package / Case
SOD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
PMEG2005EL,315
1. Product profile
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
Planar Maximum Efficiency General Application (MEGA) Schottky barrier diode with an
integrated guard ring for stress protection encapsulated in a SOD882 leadless ultra small
plastic package.
Table 1.
Symbol
I
V
F
R
PMEG2005EL
20 V, 0.5 A very low V
leadless ultra small SOD882 package
Rev. 02 — 15 January 2010
Forward current: 0.5 A
Reverse voltage: 20 V
Very low forward voltage
Leadless ultra small plastic package
Power dissipation comparable to SOT23
Ultra high-speed switching
Voltage clamping
Protection circuits
Low voltage rectification
High efficiency DC-to-DC conversion
Low power consumption applications
Quick reference data
Parameter
forward current
reverse voltage
F
MEGA Schottky barrier rectifier in
Value
0.5
20
Product data sheet
Unit
A
V

Related parts for PMEG2005EL T/R

PMEG2005EL T/R Summary of contents

Page 1

PMEG2005EL 20 V, 0.5 A very low V leadless ultra small SOD882 package Rev. 02 — 15 January 2010 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier diode with an integrated guard ring for ...

Page 2

... NXP Semiconductors 2. Pinning information Table 2. Pin 1 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Type number PMEG2005EL 4. Marking Table 4. Type number PMEG2005EL 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol FRM I FSM amb ...

Page 3

... NXP Semiconductors [1] For Schottky barrier diodes thermal run-away has to be considered some applications the reverse power losses P power losses P 6. Thermal characteristics Table 6. Symbol R th(j-a) Refer to SOD882 standard mounting conditions (footprint), FR4 with 60 μm copper strip line. [1] [2] For Schottky barrier diodes thermal run-away has to be considered some applications the reverse ...

Page 4

... NXP Semiconductors (mA (1) (2) (3) ( − 0.1 0.2 0.3 = 150 °C ( 125 °C ( °C ( °C ( Fig 1. Forward current as a function of forward voltage; typical values = 25 ° MHz; T amb Fig 3. Diode capacitance as a function of reverse voltage; typical values PMEG2005EL_2 Product data sheet 20 V, 0.5 A very low V ...

Page 5

... NXP Semiconductors 8. Package outline Leadless ultra small plastic package; 2 terminals; body 1.0 x 0 (2) DIMENSIONS (mm are the original dimensions) A (1) 1 UNIT max. 0.50 0.55 0.62 1.02 mm 0.03 0.46 0.47 0.55 0.95 Notes 1. Including plating thickness 2. The marking bar indicates the cathode ...

Page 6

... Revision history Document ID Release date PMEG2005EL_2 20100115 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. PMEG2005EL_1 20040211 PMEG2005EL_2 Product data sheet 20 V, 0.5 A very low V ...

Page 7

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 8

... NXP Semiconductors 12. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 Legal information 10.1 Data sheet status ...

Related keywords