MM908E625ACDWB Freescale Semiconductor, MM908E625ACDWB Datasheet - Page 33

• Manufacturer Part Number: MM908E625ACDWB
• Description: IC QUAD HALF BRDG MCU/LIN 54SOIC
• Manufacturer: Freescale Semiconductor

Specifications of MM908E625ACDWB

• Applications: Automotive Mirror Control
• Core Processor: HC08
• Program Memory Type: FLASH (16 kB)
• Controller Series: 908E
• Ram Size: 512 x 8
• Interface: SCI, SPI
• Number Of I /o: 13
• Voltage - Supply: 8 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 54-SOIC (0.300", 7.50mm Width) Exposed Pad
• Program Memory Size: 16 KB
• Number Of Programmable I/os: 54
• Number Of Timers: 16
• Operating Supply Voltage: - 18 V to + 28 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

OFFSET CHOPPING
set, HB1 and HB2 will continue to switch on the low-side
MOSFETs with the rising edge of the FGEN signal and HB3
and HB4 will switch on the low-side MOSFETs with the falling
Analog Integrated Circuit Device Data
Freescale Semiconductor
Low-Side Output
If bit OFC_EN in the H-Bridge Control Register (HBCTL) is
Coil Current
FGEN Input
(MCU PWM
Half-Bridge
Signal)
Minimum 50 µs
Figure 18. Half-Bridge Current Limitation
feature allows the reduction of EMI due to a reduction of the
di/dt
edge on the FGEN input. In step motor applications this
(Figure
19).
LOGIC COMMANDS AND REGISTERS
FUNCTIONAL DEVICE OPERATION
H-Bridge low-side
MOSFET will be switched
off if select current limit is
reached.
H-Bridge low-side
MOSFET will be turned on
with each rising edge of
the FGEN input.
t
t
t
908E625
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