CY7C1371D-133AXCT Cypress Semiconductor Corp, CY7C1371D-133AXCT Datasheet - Page 22

CY7C1371D-133AXCT

CY7C1371D-133AXCT

Manufacturer Part Number
CY7C1371D-133AXCT
Description
CY7C1371D-133AXCT
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1371D-133AXCT

Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
18M (512K x 36)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
100-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1371D-133AXCT
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Capacitance
Thermal Resistance
AC Test Loads and Waveforms
Note
Document Number: 38-05556 Rev. *I
C
C
C
19. Tested initially and after any design or process change that may affect these parameters.
Parameter
Parameter
IN
CLK
IO
OUTPUT
OUTPUT
3.3 V IO Test Load
2.5 V IO Test Load
JA
JC
Input capacitance
Clock input capacitance
Input/output capacitance
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to case)
Z
Z
0
0
[19]
= 50 
= 50 
Description
Description
(a)
(a)
V
V
T
T
= 1.25 V
[19]
= 1.5 V
R
R
L
L
= 50 
= 50 
OUTPUT
OUTPUT
T
V
V
Test conditions follow standard
test methods and procedures
for measuring thermal
impedance, according to
EIA/JESD51.
3.3 V
2.5 V
A
DD
DDQ
= 25 C, f = 1 MHz,
INCLUDING
INCLUDING
= 3.3 V
= 2.5 V
Test Conditions
Test Conditions
JIG AND
JIG AND
SCOPE
SCOPE
5 pF
5 pF
(b)
(b)
R = 317 
R = 1667 
R = 351 
R = 1538 
100 TQFP
100 TQFP
Package
Package
28.66
4.08
V
GND
GND
5
5
5
DDQ
V
DDQ
 1ns
 1ns
10%
10%
119 BGA
Package
119 BGA
Package
23.8
6.2
8
8
8
ALL INPUT PULSES
ALL INPUT PULSES
90%
90%
165 FBGA
165 FBGA
Package
Package
(c)
(c)
20.7
4.0
9
9
9
CY7C1371D
CY7C1373D
90%
90%
10%
10%
Page 22 of 33
C/W
C/W
Unit
Unit
pF
pF
pF
 1ns
 1ns
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