CY7C1356C-166AXCT Cypress Semiconductor Corp, CY7C1356C-166AXCT Datasheet - Page 16

• Manufacturer Part Number: CY7C1356C-166AXCT
• Description: CY7C1356C-166AXCT
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1356C-166AXCT

• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Memory Size: 9M (512K x 18)
• Speed: 166MHz
• Interface: Parallel
• Voltage - Supply: 3.135 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 100-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Scan Register Sizes
Identification Codes
Document Number: 38-05538 Rev. *L
Instruction
Bypass
ID
Boundary scan order (119-ball BGA package)
Boundary scan order (165-ball FBGA package)
EXTEST
IDCODE
SAMPLE Z
RESERVED
SAMPLE/PRELOAD
RESERVED
RESERVED
BYPASS
Instruction
Register Name
Code
000 Captures the input/output ring contents. Places the boundary scan register between the TDI and
001 Loads the ID register with the vendor ID code and places the register between TDI and TDO. This
010 Captures the input/output contents. Places the boundary scan register between TDI and TDO.
100 Captures the input/output ring contents. Places the boundary scan register between TDI and TDO.
101 Do Not Use: This instruction is reserved for future use.
011 Do Not Use: This instruction is reserved for future use.
110 Do Not Use: This instruction is reserved for future use.
111 Places the bypass register between TDI and TDO. This operation does not affect SRAM operation.
TDO. Forces all SRAM outputs to high Z state.
operation does not affect SRAM operation.
Forces all SRAM output drivers to a high Z state.
Does not affect the SRAM operation.
Bit Size (× 36)
32
69
69
3
1
Description
CY7C1354C, CY7C1356C
Bit Size (× 18)
32
69
69
3
1
Page 16 of 32
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