CY7C0853V-133BBI Cypress Semiconductor Corp, CY7C0853V-133BBI Datasheet - Page 12

IC,SYNC SRAM,256KX36,CMOS,BGA,172PIN,PLASTIC

CY7C0853V-133BBI

Manufacturer Part Number
CY7C0853V-133BBI
Description
IC,SYNC SRAM,256KX36,CMOS,BGA,172PIN,PLASTIC
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C0853V-133BBI

Format - Memory
RAM
Memory Type
SRAM - Dual Port, Synchronous
Memory Size
9M (256K x 36)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.465 V
Operating Temperature
-40°C ~ 85°C
Package / Case
172-LFBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C0853V-133BBI
Manufacturer:
GOODSKY
Quantity:
3 000
Part Number:
CY7C0853V-133BBI
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Document #: 38-06070 Rev. *D
Table 5. Scan Registers Sizes
Table 6. Instruction Identification Codes
EXTEST
BYPASS
IDCODE
HIGHZ
CLAMP
SAMPLE/PRELOAD
NBSRST
RESERVED
Note:
14. See details in the device BSDL files.
Instruction
Register Name
Boundary Scan
0000
1111
1011
0111
0100
1000
1100
All other codes Other combinations are reserved. Do not use other than the above.
Identification
Instruction
Bypass
Code
Captures the Input/Output ring contents. Places the BSR between the TDI and TDO.
Places the BYR between TDI and TDO.
Loads the IDR with the vendor ID code and places the register between TDI and TDO.
Places BYR between TDI and TDO. Forces all CY7C0851V/CY7C0852V/
CY7C0853V output drivers to a High-Z state.
Controls boundary to 1/0. Places BYR between TDI and TDO.
Captures the input/output ring contents. Places BSR between TDI and TDO.
Resets the non-boundary scan logic. Places BYR between TDI and TDO.
Description
CY7C0850V/CY7C0851V
CY7C0852V/CY7C0853V
Bit Size
n
32
[14]
4
1
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