AM29LV800BB-70EC AMD (ADVANCED MICRO DEVICES), AM29LV800BB-70EC Datasheet - Page 11

• Manufacturer Part Number: AM29LV800BB-70EC
• Description: Flash Memory IC
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of AM29LV800BB-70EC

• Memory Configuration: 1M X 8 / 512k X 16 Bit
• Memory Size: 8Mbit
• Package/case: 48-TSOP
• Supply Voltage Max: 3.6V
• Access Time, Tacc: 70nS
• Mounting Type: Surface Mount
• Supply Voltage Min: 2.7V

Special Handling Instructions for FBGA
Package
Special handling is required for Flash Memory prod-
ucts in FBGA packages.
PIN CONFIGURATION
A0–A18
DQ0–DQ14= 15 data inputs/outputs
DQ15/A-1 = DQ15 (data input/output, word
BYTE#
CE#
OE#
WE#
RESET#
RY/BY#
V
V
CC
SS
= 19 addresses
= Selects 8-bit or 16-bit mode
= Chip enable
= Output enable
= Write enable
= Hardware reset pin, active low
= Ready/Busy# output
= 3.0 volt-only single power supply
= Device ground
mode),
A-1 (LSB address input, byte
mode)
(see Product Selector Guide for
speed
options and voltage supply
tolerances)
Am29LV800B
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be compro-
mised if the package body is exposed to temperatures
above 150°C for prolonged periods of time.
NC
LOGIC SYMBOL
19
CE#
OE#
A0–A18
WE#
RESET#
BYTE#
= Pin not connected internally
DQ0–DQ15
RY/BY#
(A-1)
16 or 8
9