AM29F200BB-90EC Spansion Inc., AM29F200BB-90EC Datasheet - Page 5

Flash Memory IC

AM29F200BB-90EC

Manufacturer Part Number
AM29F200BB-90EC
Description
Flash Memory IC
Manufacturer
Spansion Inc.

Specifications of AM29F200BB-90EC

Memory Size
2Mbit
Memory Configuration
256K X 8
Ic Interface Type
Parallel
Access Time
90ns
Memory Case Style
TSOP
No. Of Pins
48
Operating Temperature Range
0°C To +70°C
Termination Type
SMD
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AM29F200BB-90EC
Manufacturer:
AMD
Quantity:
6 100
Part Number:
AM29F200BB-90EC
Manufacturer:
SPANSION
Quantity:
399
Part Number:
AM29F200BB-90EC
Manufacturer:
AMD
Quantity:
20 000
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 5
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 7
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 8
Command Definitions . . . . . . . . . . . . . . . . . . . . . 12
November 1, 2006 21526D4
Word/Byte Configuration .......................................................... 8
Requirements for Reading Array Data ..................................... 8
Writing Commands/Command Sequences .............................. 8
Program and Erase Operation Status ...................................... 9
Standby Mode .......................................................................... 9
RESET#: Hardware Reset Pin ................................................. 9
Output Disable Mode ................................................................ 9
Autoselect Mode ..................................................................... 10
Sector Protection/Unprotection ............................................... 11
Temporary Sector Unprotect .................................................. 11
Hardware Data Protection ...................................................... 11
Reading Array Data ................................................................ 12
Reset Command ..................................................................... 12
Autoselect Command Sequence ............................................ 12
Word/Byte Program Command Sequence ............................. 13
Chip Erase Command Sequence ........................................... 13
Sector Erase Command Sequence ........................................ 14
Erase Suspend/Erase Resume Commands ........................... 14
Command Definitions ............................................................. 16
DQ7: Data# Polling ................................................................. 17
RY/BY#: Ready/Busy# ........................................................... 18
DQ6: Toggle Bit I .................................................................... 18
Table 1. Am29F200B Device Bus Operations ..................................8
Table 2. Am29F200T Top Boot Block Sector Address Table .........10
Table 3. Am29F200B Bottom Boot Block Sector Address Table ....10
Table 4. Am29F200B Autoselect Codes (High Voltage Method) ....11
Figure 1. Temporary Sector Unprotect Operation........................... 11
Low V
Write Pulse “Glitch” Protection ........................................................12
Logical Inhibit ..................................................................................12
Power-Up Write Inhibit ....................................................................12
Figure 2. Program Operation .......................................................... 13
Figure 3. Erase Operation............................................................... 15
Table 5. Am29F200B Command Definitions ...................................16
Figure 4. Data# Polling Algorithm ................................................... 17
CC
Write Inhibit ......................................................................12
D A T A
Am29F200B
S H E E T
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 21
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 21
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 22
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Key to Switching Waveforms. . . . . . . . . . . . . . . . 24
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 25
Erase and Programming Performance . . . . . . . . 35
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 35
TSOP and SO Pin Capacitance . . . . . . . . . . . . . . 35
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 36
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 38
DQ2: Toggle Bit II ................................................................... 18
Reading Toggle Bits DQ6/DQ2 ............................................... 18
DQ5: Exceeded Timing Limits ................................................ 19
DQ3: Sector Erase Timer ....................................................... 19
TTL/NMOS Compatible .......................................................... 22
CMOS Compatible .................................................................. 23
Read Operations .................................................................... 25
Hardware Reset (RESET#) .................................................... 26
Word/Byte Configuration (BYTE#)
Erase/Program Operations ..................................................... 28
Temporary Sector Unprotect .................................................. 32
Alternate CE# Controlled Erase/Program Operations ............ 33
SO 044—44-Pin Small Outline Package ................................ 36
TS 048—48-Pin Standard Thin Small Outline Package ......... 37
Figure 5. Toggle Bit Algorithm........................................................ 19
Table 6. Write Operation Status ..................................................... 20
Figure 8. Test Setup....................................................................... 24
Table 7. Test Specifications ........................................................... 24
Figure 9. Read Operations Timings ............................................... 25
Figure 10. RESET# Timings .......................................................... 26
Figure 11. BYTE# Timings for Read Operations............................ 27
Figure 12. BYTE# Timings for Write Operations............................ 27
Figure 13. Program Operation Timings.......................................... 29
Figure 14. Chip/Sector Erase Operation Timings .......................... 30
Figure 15. Data# Polling Timings (During Embedded Algorithms). 31
Figure 16. Toggle Bit Timings (During Embedded Algorithms)...... 31
Figure 17. DQ2 vs. DQ6................................................................. 32
Figure 18. Temporary Sector Unprotect Timing Diagram .............. 32
Figure 19. Alternate CE# Controlled Write Operation Timings ...... 34
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