AD9763-EBZ Analog Devices Inc, AD9763-EBZ Datasheet - Page 8

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AD9763-EBZ

Manufacturer Part Number
AD9763-EBZ
Description
10 BIT, 125 MSPS Dual TxDAC+
Manufacturer
Analog Devices Inc
Series
TxDAC+®r
Datasheets

Specifications of AD9763-EBZ

Number Of Dac's
2
Number Of Bits
10
Outputs And Type
2, Differential
Sampling Rate (per Second)
125M
Data Interface
Parallel
Settling Time
35ns
Dac Type
Current
Voltage Supply Source
Analog and Digital
Operating Temperature
-40°C ~ 85°C
Utilized Ic / Part
AD9763
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
AD9763/AD9765/AD9767
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
AVDD
DVDD1, DVDD2
ACOM
AVDD
MODE,
Digital Inputs
I
REFIO, FSADJ1,
GAINCTRL, SLEEP
Junction
Storage
Lead Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
OUTA1
CLK1/IQCLK,
CLK2/IQRESET,
WRT1/IQWRT,
WRT2/IQSEL
I
FSADJ2
Temperature
Temperature
Range
(10 sec)
OUTB1
/I
OUTA2
/I
OUTB2
,
With
Respect To
ACOM
DCOM1/DCOM2
DCOM1/DCOM2
DVDD1/DVDD2
DCOM1/DCOM2
DCOM1/DCOM2
ACOM
ACOM
ACOM
Rating
−0.3 V to +6.5 V
−0.3 V to +0.3 V
−6.5 V to +6.5 V
−0.3 V to DVDD1/
DVDD2 + 0.3 V
−0.3 V to DVDD1/
DVDD2 + 0.3 V
−1.0 V to AVDD + 0.3 V
−0.3 V to AVDD + 0.3 V
−0.3 V to AVDD + 0.3 V
150°C
−65°C to +150°C
300°C
−0.3 V to +6.5 V
Rev. F | Page 8 of 44
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type
48-Lead LQFP
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
θ
91
JA
Unit
°C/W

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