AD12401-326JWS Analog Devices Inc, AD12401-326JWS Datasheet - Page 20

• Manufacturer Part Number: AD12401-326JWS
• Description: IC,A/D CONVERTER,DUAL,12-BIT,MODULE
• Manufacturer: Analog Devices Inc

Specifications of AD12401-326JWS

• Number Of Bits: 12
• Sampling Rate (per Second): 326M
• Data Interface: Parallel
• Number Of Converters: 2
• Power Dissipation (max): 6.8W
• Voltage Supply Source: Analog and Digital
• Operating Temperature: 0°C ~ 60°C
• Package / Case: Module
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

AD12401
GAIN SELECT
The AD12401 is graded out for the gain mode and should be
ordered accordingly: the AD12401-xxxKWS is calibrated in the
low gain mode, and the AD12401-xxxJWS is calibrated in the
high gain mode. Performance is not guaranteed if either grade
is used in the wrong gain mode.
The high gain mode sets the analog input voltage to
approximately 1.6 V p-p. The low gain mode sets the analog
input voltage to approximately 3.2 V p-p. For high gain mode,
the user should pull Pin 103 (H/L_GAIN) up to 3.3 V using
a 4.02 kΩ resistor. For low gain mode, the user should ground
Pin 103.
THERMAL CONSIDERATIONS
The module is rated to operate over a case temperature of 0°C
to 60°C. To maintain the tight channel matching and reliability
of the AD12401, care must be taken to ensure that proper
thermal and mechanical considerations have been made and
addressed to ensure case temperature is kept within this range.
Each application requires evaluation of the thermal manage-
ment as applicable to the system design. This section provides
information that should be used in the evaluation of the
AD12401’s thermal management for each specific use.
In addition to the radiation of heat into its environment, the
AD12401 module enables the flow of heat through the
mounting studs and standoffs as they contact the motherboard.
As described in the Package Integrity/Mounting Guidelines
section, the module should be secured to the motherboard
using 2-56 nuts (washer use is optional). The torque on the nuts
should not exceed 32-inch ounces. Using a thermal grease at the
standoffs results in better thermal coupling between the board
and module. Depending on the ambient conditions, airflow can
be necessary to ensure the components in the module do not
exceed their maximum operating temperature. For reliability,
the most sensitive component has a maximum junction
temperature rating of 125°C.
Figure 22 and Figure 23 provide a basic guideline for two key
thermal management decisions: the use of thermal interface
material between the module bottom cover/mother board and
airflow. Figure 21 characterizes the typical thermal profile of an
AD12401 that is not using thermal interface material. Figure 22
provides the same information for a configuration that uses
gap-filling thermal interface material. In this case, Thermagon
T-flex 600 Series™, 0.040” thickness, was used. These profiles
show that the maximum die temperature is reduced by
approximately 2°C when thermal interface material is used.
Figure 22 and Figure 23 also provide a guideline for determining
the airflow requirements for given ambient conditions. For
example, a goal of 120°C die temperature in a 40°C ambient
environment without the use of thermal interface material
requires an airflow of 100 LFM.
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From a channel-matching perspective, the most important
consideration is external thermal influences. It is possible for
thermal imbalances in the end application to adversely affect
the dynamic performance. Due to the temperature dependence
of the image spur, substantial deviation from the factory cali-
bration conditions can have a detrimental effect. Unbalanced
thermal influences can cause gradients across the module, and
performance degradation can result. Examples of unbalanced
thermal influences can include large heat dissipating elements
near one side of the AD12401, or obstructed airflow that does
not flow uniformly across the module. The thermal sensitivity
of the module can be affected by a change in thermal gradient
across the module of 2°C.
PACKAGE INTEGRITY/MOUNTING GUIDELINES
The AD12401 is a printed circuit board (PCB)-based module
designed to provide mechanical stability and to support the
intricate channel-to-channel matching necessary to achieve high
dynamic range performance. The module should be secured to
the motherboard using 2-56 nuts (washer use is optional). The
torque on the nuts should not exceed 32-inch ounces.
Interface Material (Normalized to 60°C Module Case Temperature Ambient)
Figure 23. Typical Temperature vs. Airflow with T-flex Module/Board
Interface Material (Normalized to 60°C Module Case Temperature)
Figure 22. Typical Temperature vs. Airflow with No Module/Board
110
100
100
110
90
80
70
60
50
40
30
20
90
80
70
60
50
40
30
20
NO AIRFLOW
NO AIRFLOW
AIRFLOW CONDITION
AIRFLOW CONDITION
TYPICAL JUNCTION
TYPICAL JUNCTION
AMBIENT
AMBIENT
100 LFM
100 LFM
CASE
CASE
300 LFM
300 LFM