ITG-3200 INVENSENSE, ITG-3200 Datasheet - Page 35

• Manufacturer Part Number: ITG-3200
• Description: IC, GYRO, TRI-AXIS, +/-2000 DEG/S
• Manufacturer: INVENSENSE

Specifications of ITG-3200

• No. Of Axes: 3
• Sensor Case Style: QFN
• No. Of Pins: 24
• Supply Voltage Range: 2.1V To 3.6V
• Operating Temperature Range: -40°C To +85°C
• Interface: I2C, Serial
• Interface Type: I2C, Serial
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

9.10
MEMS (Micro Electro-Mechanical Systems) are a time-proven, robust technology used in hundreds of millions of
consumer, automotive and industrial products. MEMS devices consist of microscopic moving mechanical structures.
They differ from conventional IC products even though they can be found in similar packages. Therefore, MEMS
devices require different handling precautions than conventional ICs prior to mounting onto printed circuit boards
(PCBs).
The ITG-3200 gyroscope has a shock tolerance of 10,000g. InvenSense packages its gyroscopes as it deems proper for
protection against normal handling and shipping. It recommends the following handling precautions to prevent potential
damage.
9.11 Gyroscope Surface Mount Guidelines
Any material used in the surface mount assembly process of the MEMS gyroscope should be free of restricted RoHS
elements or compounds. Pb-free solders should be used for assembly.
In order to assure gyroscope performance, several industry standard guidelines need to be considered for surface
mounting. These guidelines are for both printed circuit board (PCB) design and surface mount assembly and are
available from packaging and assembly houses.
When using MEMS gyroscope components in plastic packages, package stress due to PCB mounting and assembly
could affect the output offset and its value over a wide range of temperatures. This is caused by the mismatch between
the Coefficient Temperature Expansion (CTE) of the package material and the PCB. Care must be taken to avoid
package stress due to mounting.
9.12 Reflow Specification
The approved solder reflow curve shown in the figure below conforms to IPC/JEDEC J-STD-020D.01
(Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) with a maximum peak
temperature (Tc = 260°C). This is specified for component-supplier reliability qualification testing using lead-free
solder for package thicknesses less than 1.6 mm. The reliability qualification pre-conditioning used by InvenSense
incorporates three of these conforming reflow cycles. All temperatures refer to the topside of the QFN package, as
measured on the package body surface. Customer solder-reflow processes should use the solder manufacturer’s
recommendations, making sure to never exceed the constraints listed in the table and figure below, as these represent
the maximum tolerable ratings for the device. For optimum results, production solder reflow processes should use
lower temperatures, reduced exposure times to high temperatures, and lower ramp-up and ramp-down rates than those
listed below.
Individually packaged or trays of gyroscopes should not be dropped onto hard surfaces. Components placed in trays
could be subject to g-forces in excess of 10,000g if dropped.
Printed circuit boards that incorporate mounted gyroscopes should not be separated by manually snapping apart.
This could also create g-forces in excess of 10,000g.
MEMS Handling Instructions
ITG-3200 Product Specification
Document Number: PS-ITG-3200A-00-01.4
Revision: 1.4
Release Date: 03/30/2010
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