ITG-3200 INVENSENSE, ITG-3200 Datasheet - Page 34

• Manufacturer Part Number: ITG-3200
• Description: IC, GYRO, TRI-AXIS, +/-2000 DEG/S
• Manufacturer: INVENSENSE

Specifications of ITG-3200

• No. Of Axes: 3
• Sensor Case Style: QFN
• No. Of Pins: 24
• Supply Voltage Range: 2.1V To 3.6V
• Operating Temperature Range: -40°C To +85°C
• Interface: I2C, Serial
• Interface Type: I2C, Serial
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

9.7
The ITG-3200 has very low active and standby current consumption. The exposed die pad is not required for heat
sinking, and should not be soldered to the PCB since soldering to it contributes to performance changes due to package
thermo-mechanical stress.
9.8
Testing indicates that there are no specific design considerations other than generally accepted industry design practices
for component placement near the ITG-3200 multi-axis gyroscope to prevent noise coupling, and thermo-mechanical
stress.
9.9
Orientation errors of the gyroscope mounted to the printed circuit board can cause cross-axis sensitivity in which one
gyro responds to rotation about another axis, for example, the X-axis gyroscope responding to rotation about the Y or Z
axes. The orientation mounting errors are illustrated in the figure below.
orientation error.
The specification for cross-axis sensitivity in Section 3 includes the effect of the die orientation error with respect to the
package.
The table below shows the cross-axis sensitivity as a percentage of the specified gyroscope’s sensitivity for a given
Soldering Exposed Die Pad
Component Placement
PCB Mounting and Cross-Axis Sensitivity
Package Gyro Axes (
Cross-Axis Sensitivity vs. Orientation Error
Orientation Error
ITG-3200 Product Specification
) Relative to PCB Axes (
(θ or Φ)
0.5º
0º
1º
Φ
Z
Θ
Cross-Axis Sensitivity
(sinθ or sinΦ)
Y
) with Orientation Errors (Θ and Φ)
0.87%
1.75%
X
0%
Document Number: PS-ITG-3200A-00-01.4
Revision: 1.4
Release Date: 03/30/2010
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