PZU12BL,315 NXP Semiconductors, PZU12BL,315 Datasheet
PZU12BL,315
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PZU12BL,315 Summary of contents
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PZUxBL series Single Zener diodes Rev. 01 — 6 May 2008 1. Product profile 1.1 General description General-purpose Zener diodes in SOD882 leadless ultra small Surface-Mounted Device (SMD) plastic package. 1.2 Features I Non-repetitive peak reverse power dissipation ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin 1 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Type number PZU2.4BL to PZU36BL PZU2.7B2L to PZU24B2L [1] The series consists of 29 types with nominal working voltages from 2 [2] The series consists of 25 types with nominal working voltages from 2 ...
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... NXP Semiconductors Table 4. Type number PZU12BL PZU13BL PZU15BL PZU16BL PZU18BL PZU20BL PZU22BL PZU24BL PZU27BL PZU30BL PZU33BL PZU36BL 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol ZSM P ZSM P tot amb T stg [ 100 s; square wave [2] Reflow soldering is the only recommended soldering method. ...
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... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol R th(j-a) R th(j-sp) [1] Reflow soldering is the only recommended soldering method. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm [4] Soldering point of cathode tab. ...
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... NXP Semiconductors Table 8. Characteristics per type; PZU2.4BL to PZU5.6B2L unless otherwise specified. j PZUxxx Sel Working voltage V ( Min Max 4.7 B 4.42 4.90 B2 4.55 4.75 5.1 B 4.84 5.37 B2 4.98 5.20 5.6 B 5.31 5.92 B2 5.49 5.73 [ MHz [ 100 s; square wave prior to surge p j Table 9. ...
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... NXP Semiconductors Table 9. Characteristics per type; PZU6.2BL to PZU36BL unless otherwise specified. j PZUxxx Sel Working voltage V ( Min Max 15 B 13.84 15. 14.34 14. 15.37 17. 15.85 16. 16.94 19. 17.56 18. 18.86 21.08 100 B2 19.52 20. 20.88 23.17 100 B2 21.54 22. 22.93 25.57 120 B2 23.72 24. 25 MHz [ 100 s; square wave; T ...
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... NXP Semiconductors ZSM ( (prior to surge) j Fig 1. Non-repetitive peak reverse power dissipation as a function of pulse duration; maximum values (mV/ 150 C j PZU2.4BL to PZU4.3B2L Fig 3. Temperature coefficient as a function of working current; typical values PZUXBL_SER_1 Product data sheet 006aab129 300 I F (mA) 200 100 10 t (ms) p Fig 2 ...
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... NXP Semiconductors (mA) V (V) = 2.4 Z(nom PZU2.4BL to PZU4.3B2L Fig 5. Working current as a function of working voltage; typical values PZU13BL to PZU36BL Fig 7. Working current as a function of working voltage; typical values PZUXBL_SER_1 Product data sheet 006aab246 (mA) 3.6 4.3 3.0 3.9 3 (V) Z Fig ( Z(nom) (mA) ...
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... NXP Semiconductors 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors , and is suitable for use in automotive applications. 9. Package outline Fig 8. 10. Packing information Table 10 ...
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... NXP Semiconductors 11. Soldering Fig 9. PZUXBL_SER_1 Product data sheet 0.90 0.30 solder lands (2 ) 0.40 solder paste (2 ) 0.50 solder resist (2 ) occupied area Reflow soldering is the only recommended soldering method. Dimensions in mm Reflow soldering footprint SOD882 Rev. 01 — 6 May 2008 PZUxBL series Single Zener diodes 1 ...
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... NXP Semiconductors 12. Revision history Table 11. Revision history Document ID Release date PZUXBL_SER_1 20080506 PZUXBL_SER_1 Product data sheet Data sheet status Change notice Product data sheet - Rev. 01 — 6 May 2008 PZUxBL series Single Zener diodes Supersedes - © NXP B.V. 2008. All rights reserved. ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 9 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 10 Packing information Soldering ...