IDB09E120 Infineon Technologies, IDB09E120 Datasheet
IDB09E120
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IDB09E120 Summary of contents
Page 1
... Power dissipation T =25° =90°C C Operating and storage temperature Soldering temperature reflow soldering, MSL1 Rev.2.2 Ordering Code - = 25 °C, unless otherwise specified Symbol FSM I FRM Page 1 IDB09E120 Product Summary V RRM jmax PG-TO263-3-2 1 Marking Pin 1 PIN 2 D09E120 NC Value 1200 RRM 23 14 tot 69 33 -55...+150 ...
Page 2
... Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. Rev.2.2 Symbol R thJC R thJA R thJA = 25 °C, unless otherwise specified j Symbol Page 2 IDB09E120 Values Unit min. typ. max 1.8 K ...
Page 3
... Symbol t rr =25°C j =125°C j =150° rrm =25°C j =125°C j =150° =25°C j =125°C j =150° =25°C j =125°C j =150°C j Page 3 IDB09E120 Values Unit min. typ. max 140 - - 200 - - 210 - 950 - - 1470 - - 1600 ...
Page 4
... Rev.2.2 2 Diode forward current I = f(T F parameter 100 °C 150 Typ. diode forward voltage 2.6 V 2.2 1.8 1.6 1.4 1 Page 4 IDB09E120 ) C ≤ 150° 100 ) j 18A 2 9A 4,5A -60 - °C 150 T C 100 °C 160 T j 2007-09-01 ...
Page 5
... A/µs 1000 di / Typ. reverse recovery softness factor S = f(di = 125°C parameter: V 18A 9A 4,5A 700 800 A/µs 1000 di /dt F Page 5 IDB09E120 /dt 800V 125 ° 18A 9A 4,5A 200 300 400 500 600 700 /dt 800V 125° 18A 14 9A ...
Page 6
... Max. transient thermal impedance thJC p parameter : IDP09E120 10 K single pulse - Rev.2 0.50 0.20 0.10 0.05 0.02 0. Page 6 IDB09E120 2007-09-01 ...
Page 7
... Rev.2.2 Page 7 IDB09E120 2007-09-01 ...
Page 8
... Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev.2.2 Page 8 IDB09E120 2007-09-01 ...