PZU5.1B1,115 NXP Semiconductors, PZU5.1B1,115 Datasheet
PZU5.1B1,115
Specifications of PZU5.1B1,115
934059791115
PZU5.1B1 T/R
Related parts for PZU5.1B1,115
PZU5.1B1,115 Summary of contents
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PZUxB series Single Zener diodes in a SOD323F package Rev. 02 — 15 November 2009 1. Product profile 1.1 General description General-purpose Zener diodes in a SOD323F (SC-90) very small and flat lead Surface Mounted Device (SMD) plastic package. 1.2 ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin 1 2 [1] The marking bar indicates the cathode 3. Ordering information Table 3. Type number PZU2.4B to [1] PZU36B [1] The series consists of 97 types with nominal working voltages from 2 Marking Table 4. Type number PZU2.4 PZU2.7 PZU3.0 PZU3.3 PZU3.6 PZU3.9 PZU4 ...
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... NXP Semiconductors 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol ZSM P ZSM P tot amb T stg = 100 μs; square wave [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm 6 ...
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... NXP Semiconductors Table 8. Characteristics per type; PZU2.4B to PZU5.6B3 ° unless otherwise specified j PZU Sel Working Maximum differential xxx voltage resistance V (V); r (Ω) Z dif Min Max 2.4 B 2.3 2.6 1000 2.7 B 2.5 2.9 1000 B1 2.5 2.75 B2 2.65 2.9 3.0 B 2.80 3.20 1000 B1 2 ...
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... NXP Semiconductors Table 9. Characteristics per type; PZU6.2B to PZU36B ° unless otherwise specified j PZU Sel Working Maximum differential xxx voltage resistance V (V); r (Ω) Z dif Min Max 6.2 B 5.86 6. 5.86 6.12 B2 6.06 6.33 B3 6.26 6.53 6.8 B 6.47 7. 6.47 6.73 B2 6.65 6.93 B3 6.86 7 ...
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... NXP Semiconductors Table 9. Characteristics per type; PZU6.2B to PZU36B ° unless otherwise specified j PZU Sel Working Maximum differential xxx voltage resistance V (V); r (Ω) Z dif Min Max 13.84 15. 13.84 14.46 B2 14.34 14.98 B3 14.85 15. 15.37 17. 15.37 16.01 B2 15.85 16.51 B3 16.35 17. 16.94 19. 16.94 17. ...
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... NXP Semiconductors 300 I F (mA) 200 100 0 0.6 0 ° Fig 1. Forward current as a function of forward voltage; typical values (mV/K) 10 9.1 5 8.2 7.5 6.8 0 − PZU4.7B to PZU12B = 25 °C to 150 ° Fig 3. Temperature coefficient as a function of working current; typical values PZUXB_SER_2 Product data sheet ...
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... NXP Semiconductors 8. Package outline Fig 5. Package outline SOD323F (SC-90) 9. Packing information Table 10. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package PZU2.4B to PZU36B [1] For further information and the availability of packing methods, see 10. Soldering Reflow soldering is the only recommended soldering method. ...
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... NXP Semiconductors 11. Mounting Dimensions in mm PCB thickness = 1.6 mm Fig 7. FR4 PCB, standard footprint PZUXB_SER_2 Product data sheet Single Zener diodes in a SOD323F package 43.4 0.6 0.6 0.6 40 0.6 0.5 006aaa487 Rev. 02 — 15 November 2009 PZUxB series 43 0.6 0.5 0.6 Dimensions in mm PCB thickness = 1 ...
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... Revision history Document ID Release date PZUXB_SER_2 20091115 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. PZUXB_SER_1 20060307 PZUXB_SER_2 Product data sheet Single Zener diodes in a SOD323F package ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 9 Packing information . . . . . . . . . . . . . . . . . . . . . 8 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 11 Mounting Revision history ...