PBRP113ET T/R NXP Semiconductors, PBRP113ET T/R Datasheet - Page 9

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PBRP113ET T/R

Manufacturer Part Number
PBRP113ET T/R
Description
Digital Transistors BISS RET
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PBRP113ET T/R

Configuration
Single
Transistor Polarity
PNP
Typical Input Resistor
1 KOhms
Typical Resistor Ratio
1
Mounting Style
SMD/SMT
Package / Case
TO-236AB-3
Collector- Emitter Voltage Vceo Max
40 V
Peak Dc Collector Current
600 mA
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
PBRP113ET,215
NXP Semiconductors
9. Packing information
10. Soldering
PBRP113ET_1
Product data sheet
Table 8.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package
PBRP113ET
Fig 12. Reflow soldering footprint SOT23 (TO-236AB)
Fig 13. Wave soldering footprint SOT23 (TO-236AB)
For further information and the availability of packing methods, see
4.60
3.00
Packing methods
4.00
0.85
0.85
1.20
SOT23
1.30
Rev. 01 — 17 December 2007
2
2
Description
4 mm pitch, 8 mm tape and reel
3.40
2.80
4.50
2.90
2.50
1.00
3.30
3
3
PNP 800 mA, 40 V BISS RET; R1 = 1 k , R2 = 1 k
1.20 (2x)
0.50 (3x)
1
0.60 (3x)
1
0.60
(3x)
Dimensions in mm
preferred transport direction during soldering
sot023
2.70
Section
solder lands
solder resist
occupied area
[1]
PBRP113ET
Dimensions in mm
13.
solder lands
solder resist
solder paste
occupied area
Packing quantity
3000
-215
© NXP B.V. 2007. All rights reserved.
sot023
10000
-235
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