PUMD14 T/R NXP Semiconductors, PUMD14 T/R Datasheet

Digital Transistors DOUBLE RET

PUMD14 T/R

Manufacturer Part Number
PUMD14 T/R
Description
Digital Transistors DOUBLE RET
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PUMD14 T/R

Configuration
Dual
Transistor Polarity
NPN/PNP
Typical Input Resistor
47 KOhms
Mounting Style
SMD/SMT
Package / Case
SOT-363-6
Collector- Emitter Voltage Vceo Max
50 V
Peak Dc Collector Current
100 mA
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
PUMD14,115
1. Product profile
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
NPN/PNP resistor-equipped transistors
Table 1.
I
I
I
I
I
I
I
Table 2.
Type number
PEMD14
PUMD14
Symbol
V
I
R1
O
CEO
PEMD14; PUMD14
NPN/PNP resistor-equipped transistors;
R1 = 47 k , R2 = open
Rev. 02 — 2 September 2009
Built-in bias resistors
Simplifies circuit design
Reduces component count
Reduces pick and place cost
Low current peripheral driver
Control of IC inputs
Replacement of general-purpose transistors in digital applications
Product overview
Quick reference data
Parameter
collector-emitter voltage
output current (DC)
bias resistor 1 (input)
Package
NXP
SOT666
SOT363
Conditions
open base
JEITA
-
SC-88
Min
-
-
33
PNP/PNP
complement
PEMB14
PUMB14
Typ
-
-
47
Product data sheet
Max
50
100
61
NPN/NPN
complement
PEMH14
PUMH14
Unit
V
mA
k

Related parts for PUMD14 T/R

PUMD14 T/R Summary of contents

Page 1

... Built-in bias resistors I Simplifies circuit design I Reduces component count I Reduces pick and place cost 1.3 Applications I Low current peripheral driver I Control of IC inputs I Replacement of general-purpose transistors in digital applications 1.4 Quick reference data Table 2. Symbol V CEO Product overview Package NXP JEITA ...

Page 2

... NXP Semiconductors 2. Pinning information Table 3. Pin Ordering information Table 4. Type number PEMD14 PUMD14 4. Marking Table 5. Type number PEMD14 PUMD14 [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China PEMD14_PUMD14_2 Product data sheet NPN/PNP resistor-equipped transistors open Pinning Description GND (emitter) TR1 ...

Page 3

... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per transistor; for the PNP transistor with negative polarity V CBO V CEO V EBO tot T stg amb Per device P tot [1] Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint. ...

Page 4

... NXP Semiconductors 7. Characteristics Table 8. Characteristics unless otherwise specified amb Symbol Parameter Per transistor; for the PNP transistor with negative polarity I collector-base cut-off CBO current I collector-emitter CEO cut-off current I emitter-base cut-off EBO current h DC current gain FE V collector-emitter CEsat saturation voltage ...

Page 5

... NXP Semiconductors (1) ( 100 C amb ( amb ( amb Fig 1. TR1 (NPN): DC current gain as a function of collector current; typical values 1000 ( (2) (3) 100 ( 100 C amb ( amb ( amb Fig 3. TR2 (PNP): DC current gain as a function of collector current; typical values PEMD14_PUMD14_2 Product data sheet NPN/PNP resistor-equipped transistors open ...

Page 6

... NXP Semiconductors 8. Package outline Plastic surface-mounted package; 6 leads y 6 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max 0.30 1.1 0.25 mm 0.1 0.20 0.8 0.10 OUTLINE VERSION IEC SOT363 Fig 5. Package outline SOT363 (SC-88) PEMD14_PUMD14_2 Product data sheet NPN/PNP resistor-equipped transistors open ...

Page 7

... NXP Semiconductors Plastic surface-mounted package; 6 leads pin 1 index DIMENSIONS (mm are the original dimensions) UNIT 0.6 0.27 0.18 1.7 mm 0.5 0.17 0.08 1.5 OUTLINE VERSION IEC SOT666 Fig 6. Package outline SOT666 PEMD14_PUMD14_2 Product data sheet NPN/PNP resistor-equipped transistors open scale 1.3 1.7 ...

Page 8

... NXP Semiconductors 9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package PEMD14 SOT666 PUMD14 SOT363 PUMD14 SOT363 [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping ...

Page 9

... Document ID Release date PEMD14_PUMD14_2 20090902 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure 5 “Package outline SOT363 • Figure 6 “Package outline ...

Page 10

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 11

... NXP Semiconductors 13. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Packing information Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 11 Legal information ...

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