PUMB14 T/R NXP Semiconductors, PUMB14 T/R Datasheet
PUMB14 T/R
Specifications of PUMB14 T/R
Related parts for PUMB14 T/R
PUMB14 T/R Summary of contents
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... Built-in bias resistors I Simplifies circuit design I Reduces component count I Reduces pick and place cost 1.3 Applications I Low current peripheral driver I Control of IC inputs I Replacement of general-purpose transistors in digital applications 1.4 Quick reference data Table 2. Symbol V CEO Product overview Package NXP JEITA ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin Ordering information Table 4. Type number PEMB14 PUMB14 4. Marking Table 5. Type number PEMB14 PUMB14 [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China PEMB14_PUMB14_2 Product data sheet PNP/PNP resistor-equipped transistors open Pinning Description GND (emitter) TR1 ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per transistor V CBO V CEO V EBO tot T stg amb Per device P tot [1] Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. ...
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... NXP Semiconductors 7. Characteristics Table 8. Characteristics unless otherwise specified amb Symbol Parameter Per transistor I collector-base cut-off CBO current I collector-emitter CEO cut-off current I emitter-base cut-off EBO current h DC current gain FE V collector-emitter CEsat saturation voltage R1 bias resistor 1 (input) C collector capacitance c 1000 ( (2) (3) ...
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... NXP Semiconductors 8. Package outline Plastic surface-mounted package; 6 leads y 6 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max 0.30 1.1 0.25 mm 0.1 0.20 0.8 0.10 OUTLINE VERSION IEC SOT363 Fig 3. Package outline SOT363 (SC-88) PEMB14_PUMB14_2 Product data sheet PNP/PNP resistor-equipped transistors open ...
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... NXP Semiconductors Plastic surface-mounted package; 6 leads pin 1 index DIMENSIONS (mm are the original dimensions) UNIT 0.6 0.27 0.18 1.7 mm 0.5 0.17 0.08 1.5 OUTLINE VERSION IEC SOT666 Fig 4. Package outline SOT666 PEMB14_PUMB14_2 Product data sheet PNP/PNP resistor-equipped transistors open scale 1.3 1.7 ...
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... NXP Semiconductors 9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package PEMB14 SOT666 PUMB14 SOT363 PUMB14 SOT363 [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping ...
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... Document ID Release date PEMB14_PUMB14_2 20090831 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure 3 “Package outline SOT363 • Figure 4 “Package outline ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 13. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Packing information Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 11 Legal information ...