PZU6.8DB2,115 NXP Semiconductors, PZU6.8DB2,115 Datasheet - Page 3
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PZU6.8DB2,115
Manufacturer Part Number
PZU6.8DB2,115
Description
DIODE ZENER DUAL 6.8V SC-88A
Manufacturer
NXP Semiconductors
Specifications of PZU6.8DB2,115
Package / Case
6-TSSOP (5 lead), SC-88A, SOT-353
Voltage - Zener (nom) (vz)
6.8V
Voltage - Forward (vf) (max) @ If
900mV @ 10mA
Current - Reverse Leakage @ Vr
500nA @ 3.5V
Configuration
2 Independent
Power - Max
250mW
Impedance (max) (zzt)
20 Ohm
Tolerance
±2%
Mounting Type
Surface Mount
Operating Temperature
-55°C ~ 150°C
Zener Voltage
6.79 V
Voltage Tolerance
2 %
Voltage Temperature Coefficient
3.4 mV / K
Power Dissipation
275 mW
Maximum Reverse Leakage Current
0.5 uA
Maximum Zener Impedance
20 Ohms
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 65 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
934061541115
PZU6.8DB2 T/R
PZU6.8DB2 T/R
PZU6.8DB2 T/R
PZU6.8DB2 T/R
NXP Semiconductors
5. Limiting values
6. Thermal characteristics
7. Characteristics
PZUXB_SER_2
Product data sheet
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
Table 6.
[1]
[2]
[3]
Table 7.
T
[1]
Symbol
I
I
P
P
T
T
T
Symbol
R
R
Symbol
V
F
ZSM
j
j
amb
stg
ZSM
tot
F
th(j-a)
th(j-sp)
= 25
t
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm
Soldering point of cathode tab
Pulse test: t
p
= 100 μs; square wave; T
°
C unless otherwise specified
Parameter
forward current
non-repetitive peak reverse
current
non-repetitive peak reverse
power dissipation
total power dissipation
junction temperature
ambient temperature
storage temperature
Limiting values
Thermal characteristics
Characteristics
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to solder point
Parameter
forward voltage
p
≤ 300 μs; δ ≤ 0.02
Rev. 02 — 15 November 2009
j
= 25 °C prior to surge
Conditions
I
I
F
F
= 10 mA
= 100 mA
Conditions
T
Conditions
in free air
amb
≤ 25 °C
Single Zener diodes in a SOD323F package
[1]
[1]
[1]
[2]
[3]
Min
-
-
-
-
Min
-
-
-
-
−65
−65
[1]
[2]
[3]
PZUxB series
Min
-
-
-
Typ
-
-
Typ
-
-
-
Max
200
see
and
40
310
550
150
+150
+150
© NXP B.V. 2009. All rights reserved.
Max
0.9
1.1
Table 8
9
Max
400
230
55
2
2
Unit
V
V
.
.
Unit
K/W
K/W
K/W
Unit
mA
W
mW
mW
°C
°C
°C
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