E-L6210 STMicroelectronics, E-L6210 Datasheet - Page 5
![IC SCHOTTKY DIO BRDG DUAL 16DIP](/photos/5/23/52339/497-16-dip_series_sml.jpg)
E-L6210
Manufacturer Part Number
E-L6210
Description
IC SCHOTTKY DIO BRDG DUAL 16DIP
Manufacturer
STMicroelectronics
Datasheet
1.E-L6210.pdf
(8 pages)
Specifications of E-L6210
Voltage - Peak Reverse (max)
50V
Current - Dc Forward (if)
2A
Diode Type
Single Phase, Dual Schottky
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type
Through Hole
Package / Case
16-DIP (0.300", 7.62mm)
Product
Single Phase Bridge
Peak Reverse Voltage
50 V
Forward Voltage Drop
1.2 V
Maximum Operating Temperature
+ 70 C
Length
19.18 mm
Width
6.35 mm
Height
3.3 mm
Mounting Style
Through Hole
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-8816-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
L6210
3
Mounting instructions
The R
area of the printed circuit boards as shown in
During soldering the pin temperature must not exceed 260°C and the soldering time must
not be longer then 12 s. The external heatsink or printed circuit copper area must be
connected to electrical ground.
Figure 3.
Figure 4.
th j-am
b of the L6210 can be reduced by soldering the GND pins to suitable copper
Example of PC board copper area which is used as heatsink
Example of an external heatsink
Figure 3
or to an external heatsink
Mounting instructions
(Figure
4).
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