PEMI4CSP/RT NXP Semiconductors, PEMI4CSP/RT Datasheet - Page 11

• Manufacturer Part Number: PEMI4CSP/RT
• Manufacturer: NXP Semiconductors

Specifications of PEMI4CSP/RT

• Operating Temperature Min Deg. C: -40C
• Operating Temperature Max Deg. C: 85C
• Rad Hardened: No
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
10. Design and assembly recommendations
PEMIXCSP_FAM
Product data sheet
10.1 PCB design guidelines
10.2 PCB assembly guidelines for Pb-free soldering
It is recommended, for optimum performance, to use a Non-Solder Mask
Defined (NSMD), also known as a copper-defined design, incorporating laser-drilled
micro-vias connecting the ground pads to a buried ground-plane layer. This results in the
lowest possible ground inductance and provides the best high frequency and
ESD performance. Refer to
design parameters.
Table 10.
Table 11.
Parameter
PCB pad diameter
Micro-via diameter
Solder mask aperture diameter
Copper thickness
Copper finish
PCB material
Parameter
Solder screen aperture diameter
Solder screen thickness
Solder paste: Pb-free
Solder to flux ratio
Solder reflow profile
Recommended PCB design parameters
Assembly recommendations
All information provided in this document is subject to legal disclaimers.
4-, 6- and 8-channel passive filter network with ESD protection
Rev. 1 — 3 February 2011
Table 10
for the recommended Printed-Circuit Board (PCB)
Value or specification
250 μm
100 μm (0.004 inch)
325 μm
20 μm to 40 μm
AuNi
FR4
Value or specification
290 μm
100 μm (0.004 inch)
SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %)
50 : 50
see
Figure 14
PEMIxCSP family
© NXP B.V. 2011. All rights reserved.
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