1981568-1 TE Connectivity, 1981568-1 Datasheet - Page 66

• Manufacturer Part Number: 1981568-1
• Description: REC TYPE B ASSY (AU) MICRO USB
• Manufacturer: TE Connectivity
• Series: DisplayPort Receptacles and Cable Assembliesr

Specifications of 1981568-1

• Number Of Contacts: 5POS
• Body Orientation: Right Angle
• Contact Material: Copper Alloy
• Operating Temp Range: -55C to 85C
• Current Rating (max): 1/ContactA
• Voltage Rating Max: 30VAC
• Product Height (mm): 3mm
• Number Of Ports: 1Port
• Gender: RCP
• Mounting Style: Surface Mount
• Contact Plating: Gold Over Nickel
• Housing Material: Thermoplastic
• Product: Micro USB Type B Connectors
• Standard: USB
• Pitch: 0.65 mm
• Current Rating: 1 A
• Termination Style: Solder Pad
• Connector Type: Micro USB Type B Receptacle
• Color: Black
• Features: Without Locking Feature
• Flammability Rating: UL 94 V-0
• Insulation Resistance: 100 MOhms
• Mounting Angle: Right
• Number Of Positions / Contacts: 5
• Operating Temperature Range: 0 C to + 50 C
• Voltage Rating: 30 VAC
• Size: Micro
• Orientation: Right Angle
• Mount Location: Top
• Termination Method: Surface Mount
• Locking Feature: Without
• Led: Without
• Panel Ground: Without
• Pcb Mount Retention Type: SMT Hold Down
• Shell Plating: Reflowed Tin over Nickel
• Assembly Process Feature: Without Pick and Place Cover
• Locating Post(s): Without
• Number Of Positions: 5
• Contact Termination Type: Surface Mount
• Contact Plating, Mating Area, Material: Gold
• Contact Plating, Mating Area, Thickness (µm [?in]): 0.762 [30]
• Housing Color: Black
• Industry Standard: USB 2.0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Usb-if Test Id Number (tid): 60001336
• Applies To: Printed Circuit Board
• Pcb Thickness, Recommended (mm [in]): 1.00 [0.039]
• Packaging Method: Tape & Reel
• Lead Free Status / RoHS Status: Compliant

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Products for Mobile Equipment
MID Technology
MID
Laser Direct Structuring Technology
Laser Direct Structuring (LDS) Technology
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3D Part Design
Tyco Electronics provides its customers vast design expertise over a wide variety of manufac-
turing technologies. Our design engineers are experts in two shot design and product integration
for MID products. Optimal solutions are engineered with the appropriate MID technology to best
suit the application.
Modeling and Simulation
Tyco Electroniocs employs the most up
to date design tools available. We use
sophisticated 3D modeling and simulation
packages to accurately manufacture and
predict the end product.
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All specifications subject to change. Consult Tyco Electronics for latest specifications.
Offers the ability to create parts with finer line width and spacing than conventional MID
processes will allow for.
The structure is molded in a standard single shot mold using one of several proprietary plastics
available.
Desired interconnect pattern is directly written on the resulting molded part and the conductive
paths are plated using industry standard methods.
The plating adheres only where the plastic has been activated by the laser.
Pro Engineer Wildfire 2.0 CAD software
Auto CAD 2005
MPA Moldflow to predict molding
behaviors
Pro Mechanica stress and thermal
analysis software
Catalog 1654270-2
Revised 8-2007