787883-1 TE Connectivity, 787883-1 Datasheet - Page 2

• Manufacturer Part Number: 787883-1
• Manufacturer: TE Connectivity
• Type: SCSIr

Specifications of 787883-1

• Termination Method: Solder
• Body Orientation: Right Angle
• Gender: F
• Pitch (mm): 1.27mm
• Number Of Contacts: 200POS
• Contact Plating: Gold Over Nickel
• Housing Material: Polyester
• Mounting Style: Through Hole
• Product Type: Connector
• Profile: Low
• Pcb Mount Style: Through Hole (SMT Compatible)
• Pcb Mount Retention: With
• Pcb Mounting Orientation: Right Angle
• Type Of Connector: Blindmate
• Pcb Mount Alignment: Without
• Footprint (mm [in]): 8-Row [8-Row]
• Retention Leg Material: Brass
• Shell Material: Carbon Steel
• Ground Plate Material: Stainless Steel
• Guide Socket [pin] Material: Brass
• Locking Screw: Without
• Retention Leg Plating: Tin-lead over Nickel
• Termination Post Length (mm [in]): 2.49 [0.098]
• Solder Tail Contact Plating: Tin-Lead over Nickel
• Number Of Positions: 200
• Centerline (mm [in]): 1.27 [0.050]
• Pcb Mount Retention Type: Boardlock(s)
• Center Ground Plate: With
• Shell Plating: Nickel over Copper
• Guide Socket [pin] Plating: Nickel over Copper
• Contact Plating, Mating Area, Material: Gold (30)
• Connector Style: Receptacle
• Housing Temperature Rating: Standard
• Housing Color: Natural
• Rohs/elv Compliance: Not ELV/RoHS compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Applies To: Printed Circuit Board
• Application: Box-to-Box
• Lead Free Status / RoHS Status: Not Compliant

3.3.
3.4.
3.5.
Rev A
Examination of product.
Termination resistance.
Insulation resistance.
Dielectric withstanding voltage.
Solderability.
Vibration, random.
Mechanical shock, specified pulse.
Durability.
Ratings
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Performance and Test Description
Product is designed to meet the electrical, mechanical and environmental performance requirements
specified in Figure 1. Unless otherwise specified, all tests shall be performed at ambient environmental
conditions per Test Specification 109-1.
Test Requirements and Procedures Summary
Test Description
Voltage: 500 volts AC
Current: Signal application only
Temperature: -55 to 85° C
Meets requirements of product
drawing.
∆R 25 milliohms maximum.
1000 megohms minimum.
500 vac at sea level.
1 minute hold with no breakdown or
flashover.
Solderable area shall have
minimum of 95% solder coverage.
No discontinuities of 1 microsecond
or longer duration.
See Note.
No discontinuities of 1 microsecond
or longer duration.
See Note.
See Note.
Figure 1 (continued)
MECHANICAL
ELECTRICAL
Requirement
Visual, dimensional and functional
per applicable quality inspection
plan.
TE Spec 109-6-1.
Subject samples to 50 mv
maximum open circuit at 100 ma
maximum.
See Figure 3.
TE Spec 109-28-4.
Test between adjacent contacts of
mated samples.
TE Spec 109-29-1.
Test between adjacent contacts of
mated samples.
TE Spec 109-11-2.
Subject contacts to solderability.
TE Spec 109-21-7.
Subject mated samples to 3.13 G's
rms between 5-500 Hz. 15 minutes
in each of 3 mutually perpendicular
planes.
See Figure 4.
TE Spec 109-26-1, except 30 G’s.
Subject mated samples to 30 G's
half-sine shock pulses of 11
milliseconds duration. 3 shocks in
each direction applied along 3
mutually perpendicular planes, 18
total shocks.
See Figure 4.
TE Spec 109-27.
Mate and unmate samples for 500
cycles at a maximum rate of 600
cycles per hour.
Procedure
108-1752
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