787597-3 TE Connectivity, 787597-3 Datasheet - Page 4

• Manufacturer Part Number: 787597-3
• Manufacturer: TE Connectivity
• Type: SCSIr

Specifications of 787597-3

• Number Of Terminals: 40
• Termination Method: Solder
• Body Orientation: Straight
• Gender: RCP
• Number Of Ports: 1Port
• Pitch (mm): 1.27mm
• Number Of Contacts: 40POS
• Mounting Style: Through Hole
• Product Type: Connector
• Profile: High
• Pcb Mount Style: Through Hole
• Pcb Mount Retention: With
• Pcb Mounting Orientation: Vertical
• Type Of Connector: Blindmate
• Pcb Mount Alignment: With
• Pcb Mount Alignment Type: Post Polarization
• Retention Leg Material: Brass
• Color: Black
• Sealed Bottom: Without
• Product Series: Series I
• Retention Leg Plating: Tin over Nickel
• Termination Post Length (mm [in]): 4.57 [0.180]
• Solder Tail Contact Plating: Tin over Nickel
• Number Of Positions: 40
• Centerline (mm [in]): 1.27 [0.050]
• Pcb Mount Retention Type: Boardlock(s)
• Contact Plating, Mating Area, Material: Gold (30)
• Contact Base Material: Phosphor Bronze
• Connector Style: Receptacle
• Housing Temperature Rating: High
• Housing Material: Polyester
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C, Reflow solder capable to 245°C, Reflow solder capable to 260°C, Pin-in-Paste capable to 245°C, Pin-in-Paste capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Applies To: Printed Circuit Board
• Application: Fibre Channel Disk Drive, High Speed Serial Data, SCA2 (Single Connector Attachment)
• Lead Free Status / RoHS Status: Compliant

3.6.
Rev A
Product Qualification and Requalification Test Sequence
NOTE
(a) See paragraph 4.1.A.
(b) Numbers indicate sequence in which tests are performed.
(c)
Precondition samples with 10 cycles durability.
Examination of product
Termination resistance
Insulation resistance
Dielectric withstanding voltage
Temperature rise vs current
Solderability
Vibration
Physical shock
Durability
Mating force
Unmating force
Thermal shock
Humidity-temperature cycling
Temperature life
Mixed flowing gas
Test or Examination
Figure 3
1,9
3,7
1
5
6
4
2
8
Test Sequence (b)
Test Group (a)
3(c)
1,8
2,6
2
7
5
4
1,8
2,6
3,7
3
4
5
1,3
4
2
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