1981584-1 TE Connectivity, 1981584-1 Datasheet - Page 76

• Manufacturer Part Number: 1981584-1
• Description: RECEPTACLE, MICRO USB, TYPE AB
• Manufacturer: TE Connectivity
• Series: ABr

Specifications of 1981584-1

• Gender: RCP
• Number Of Ports: 1Port
• Body Orientation: Right Angle
• Number Of Terminals: 5
• Contact Material: Copper Alloy
• Number Of Contacts: 5POS
• Mounting Style: Surface Mount
• Termination Method: Solder
• Housing Material: Thermoplastic
• Contact Plating: Gold Over Nickel
• Pitch (mm): 0.65mm
• Connector Type: Series
• No. Of Contacts: 5
• Contact Termination: Surface Mount Horizontal
• Connector Mounting: PCB
• Rohs Compliant: Yes
• Product: Micro USB Type AB Connectors
• Standard: USB
• Termination Style: SMD/SMT
• Number Of Positions / Contacts: 5
• Size: Micro
• Orientation: Right Angle
• Mount Location: Top
• Locking Feature: Without
• Led: Without
• Panel Ground: Without
• Pcb Mount Retention Type: SMT Hold Down
• Shell Plating: Reflowed Tin over Nickel
• Assembly Process Feature: Without Pick and Place Cover
• Locating Post(s): Without
• Number Of Positions: 5
• Contact Termination Type: Surface Mount
• Contact Plating, Mating Area, Material: Gold
• Contact Plating, Mating Area, Thickness (µm [?in]): 0.762 [30]
• Housing Color: Gray
• Industry Standard: USB 2.0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Usb-if Test Id Number (tid): 60001338
• Applies To: Printed Circuit Board
• Pcb Thickness, Recommended (mm [in]): 1.00 [0.039]
• Packaging Method: Tape & Reel
• Lead Free Status / RoHS Status: Compliant

LAMFRAME
Key Features
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Low cost tape for memory
and microprocessor
applications
Compatible with industry
standard processes
Allow wide range of dielectric
(type and thickness)
Optimisation of dielectric
area for cost reduction
Minimum Slit Size:
0.15 mm
Products for Mobile Equipment
Mechatronic Center Niefern
LAMFRAME
This technology allows Tyco Electronics to
offer a wide range of products for memory
and microprocessor smart cards with:
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Lamination process is carried out in a clean room to avoid any outside contamination.
Tyco Electronics is able to perform bonding tests with gold or aluminium wires during design phase
but also to ensure the quality during all the life time of the products.
Products are today customer specific, Tyco Electronics Open Design available.
All specifications subject to change. Consult Tyco Electronics for latest specifications.
Plating Finishes
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Dielectric
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Customized thickness
Disconnection option
Gold
“Grey like” plating
Polyimide
Glass epoxy
Polyester
…
Catalog 1654270-2
Revised 8-2007