1981584-1 TE Connectivity, 1981584-1 Datasheet - Page 75

• Manufacturer Part Number: 1981584-1
• Description: RECEPTACLE, MICRO USB, TYPE AB
• Manufacturer: TE Connectivity
• Series: ABr

Specifications of 1981584-1

• Gender: RCP
• Number Of Ports: 1Port
• Body Orientation: Right Angle
• Number Of Terminals: 5
• Contact Material: Copper Alloy
• Number Of Contacts: 5POS
• Mounting Style: Surface Mount
• Termination Method: Solder
• Housing Material: Thermoplastic
• Contact Plating: Gold Over Nickel
• Pitch (mm): 0.65mm
• Connector Type: Series
• No. Of Contacts: 5
• Contact Termination: Surface Mount Horizontal
• Connector Mounting: PCB
• Rohs Compliant: Yes
• Product: Micro USB Type AB Connectors
• Standard: USB
• Termination Style: SMD/SMT
• Number Of Positions / Contacts: 5
• Size: Micro
• Orientation: Right Angle
• Mount Location: Top
• Locking Feature: Without
• Led: Without
• Panel Ground: Without
• Pcb Mount Retention Type: SMT Hold Down
• Shell Plating: Reflowed Tin over Nickel
• Assembly Process Feature: Without Pick and Place Cover
• Locating Post(s): Without
• Number Of Positions: 5
• Contact Termination Type: Surface Mount
• Contact Plating, Mating Area, Material: Gold
• Contact Plating, Mating Area, Thickness (µm [?in]): 0.762 [30]
• Housing Color: Gray
• Industry Standard: USB 2.0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Usb-if Test Id Number (tid): 60001338
• Applies To: Printed Circuit Board
• Pcb Thickness, Recommended (mm [in]): 1.00 [0.039]
• Packaging Method: Tape & Reel
• Lead Free Status / RoHS Status: Compliant

Mechatronic Center
Niefern
Advanced Tyco Electronics
technologies allow us to
produce highly competitive
semi-finished products for
card manufacturers of the
1
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The products are delivered
on a reel and can be used
for chip mounting by our
customers.
st
, 2
High-Speed Stamping
Selective Plating
Laminating
Reel-to-Reel Over-Molding
nd
and 3
rd
generation.
Products for Mobile Equipment
Mechatronic Center Niefern
Technology Portfolio
All specifications subject to change. Consult Tyco Electronics for latest specifications.
Reel-to-Reel
Over-Molding
■
■
Free cutting in line
Multiple cavities
mold
Reel-to-Reel Stamping
■
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Reel-to-Reel Plating
■
■
■
Reel-to-Reel Lamination
■
■
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Bonding Capability Guaranty
High-speed stamping
4 fold stamping tool,
70 mm width
Material: Copper alloy
Plating in 70 mm width
Selective Metalization:
●
●
●
Slitting in 35 mm
Clean room class 100,000
High accuracy dielectric
stamping
Mechanical alignment and
prefixing of dielectric
Leadframe roll lamination
100 % video control
Overall Ni
Contacts Side:
– Spots on contact area
– Gold flash
Bonding Side:
– Strips or Spots
Catalog 1654270-2
Revised 8-2007
73