EMIF02USB05C2 STMicroelectronics, EMIF02USB05C2 Datasheet

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EMIF02USB05C2

Manufacturer Part Number
EMIF02USB05C2
Description
Manufacturer
STMicroelectronics
Type
EMI Filterr
Datasheet

Specifications of EMIF02USB05C2

Mounting Style
Surface Mount
Termination
Flat Style
Operating Temp Range
-40C to 85C
Product Height (mm)
0.69mm
Product Depth (mm)
0.92mm
Product Length (mm)
1.92mm
Lead Free Status / RoHS Status
Compliant
IPAD™
Main application
When EMI filtering is ESD sensitive equipment is
required:
Description
The EMIF02-USB05C2 is a highly integrated
array designed to suppress EMI / RFI noise for
USB port filtering. The EMIF02-USB05C2 Flip-
Chip packaging means the package size is equal
to the die size.
Additionally, this low-pass filter includes an ESD
protection circuitry to prevent damage to the
application when subjected to ESD surges up
to 15 kV.
This device is designed to be fully compatible with
USB standards.
Benefits
Complies with following standards:
IEC 61000-4-2
level 4
MIL STD 883G - Method 3015-7 Class 3
November 2006
Mobile phones and communication systems
Computers, printers and MCU boards
2 x EMI low-pass filter + 2 line ESD protection
1.5 kΩ pull-up included
High efficiency in EMI filtering
Lead free coated package
Very low PCB space consumption:
1.92 mm x 0.92 mm
Very thin package: 0.69 mm
High reliability offered by monolithic integration
High reduction of parasitic elements through
integration and wafer level packaging
USB full speed (12 Mbps), OTG compliant
15 kV (air discharge)
8 kV (contact discharge)
2 line EMF filter including ESD protection
Rev 2
Pin configuration (bump side)
Functional diagram
Order code
TM: IPAD is a trademark of STMicroelectronics
EMIF02-USB05C2
Part Number
GND
IO4
IO3
EMIF02-USB05C2
Coated Flip-Chip
(8 Bumps)
IO4
IO3
O2
O1
2
Input 2
Input 1
GND
V
I2
I1
1
CC
A
B
C
D
R1
R2
Marking
R3
GV
V
Output2
Output 1
CC
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EMIF02USB05C2 Summary of contents

Page 1

... MIL STD 883G - Method 3015-7 Class 3 November 2006 EMIF02-USB05C2 2 line EMF filter including ESD protection Coated Flip-Chip Pin configuration (bump side) Functional diagram IO4 IO3 GND Order code Part Number EMIF02-USB05C2 TM: IPAD is a trademark of STMicroelectronics Rev 2 (8 Bumps IO4 ...

Page 2

Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values) Symbol T Maximum junction temperature j T Operating temperature range op T Storage temperature range stg Table 2. Electrical characteristics (T Symbol V Breakdown voltage BR I Leakage current @ V ...

Page 3

EMIF02-USB05C2 Figure 1. S21 (dB) attenuation measurement Figure 2. dB 0.00 - -10. -20.00 - -30. (Hz) - -40. 100.0k 1.0M 10.0M Figure 3. ESD response to IEC 61000-4-2 (+15 ...

Page 4

Ordering information scheme Figure 6. Aplac model device structure Rbump Lbump MODEL bulk C1 Rbump Lbump MODEL = D1 bulk Figure 7. Aplac model parameters 2 Ordering information scheme EMI Filter Number of lines Information 3 letters ...

Page 5

EMIF02-USB05C2 3 Package information Figure 8. Flip-Chip package dimensions Figure 9. Foot print recomendations Copper pad Diameter: 250 µm recommended, 300 µm max Solder stencil opening: 330 µm Solder mask opening recommendation: 340 µm min for 315 µm copper pad ...

Page 6

Ordering information Note: More packing information is available in the application notes AN1235: “Flip-Chip: Package description and recommendations for use” AN1751: “EMI Filters: Recommendations and measurements” In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These ...

Page 7

... EMIF02-USB05C2 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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