GCM21B5C1H223JA16L Murata, GCM21B5C1H223JA16L Datasheet - Page 63

• Manufacturer Part Number: GCM21B5C1H223JA16L
• Manufacturer: Murata

Specifications of GCM21B5C1H223JA16L

• Tolerance (+ Or -): 5%
• Voltage: 50VDC
• Temp Coeff (dielectric): C0G
• Operating Temp Range: -55C to 125C
• Mounting Style: Surface Mount
• Construction: SMT Chip
• Case Style: Ceramic Chip
• Failure Rate: Not Required
• Wire Form: Not Required
• Product Length (mm): 2mm
• Product Depth (mm): 1.25mm
• Product Height (mm): 1.25mm
• Product Diameter (mm): Not Requiredmm
• Capacitance: .022uF
• Package / Case: 0805
• Lead Free Status / RoHS Status: Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
c Notice (Soldering and Mounting)
1. Construction of Board Pattern
Construction and Dimensions of Pattern (Example)
Dimensions of Slit (Example)
Land Layout to Prevent Excessive Solder
Examples of
Prohibition
Examples of
Improvements
by the Land
Division
After installing chips, if solder is excessively applied to
the circuit board, mechanical stress will cause destruction
resistance characteristics to lower. To prevent this, be
extremely careful in determining shape and dimension
before designing the circuit board diagram.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Chip Capacitor
Chip Capacitor
Preparing slit helps flux cleaning and resin coating on the back of the capacitor.
But, the length of slit design should be shorter enough as much as possible to prevent the mechanical damage in the capacitor.
The longer slit design might receive more severe mechanical stress from the PCB.
Recommendable slit design is shown in the Table.
c
b
Solder Resist
Mounting Close to a Chassis
a
d
e
d
d
1
Chassis
2
Slit
Land Pattern
Solder Resist
Solder Resist
Base board
Solder (Ground solder)
Land
Land
d
1
<d
Adhesive
2
in section
in section
L
L
W
W
Mounting with Leaded Components
Solder Resist
Flow Soldering
Flow soldering : 3.2g1.6 or less available.
Reflow Soldering
2.0g1.25
3.2g1.6
2.0g1.25
3.2g1.6
3.2g2.5
4.5g3.2
5.7g5.0
2.0g1.25
3.2g1.6
3.2g2.5
LgW
LgW
LgW
Lead Wire Connected
to a Part Provided
with Lead Wires.
in section
in section
1.0-1.2
2.2-2.6
1.0-1.2
2.2-2.4
2.0-2.4
2.8-3.4
4.0-4.6
1.0-2.0
1.0-2.0
a
d
a
-
Mounting Leaded Components Later
0.9-1.0
1.0-1.1
0.6-0.7
0.8-0.9
1.0-1.2
1.2-1.4
1.4-1.6
3.2-3.7
4.1-4.6
(in mm)
b
b
e
-
Continued on the following page.
Solder Resist
0.8-1.1
1.0-1.4
0.8-1.1
1.0-1.4
1.8-2.3
2.3-3.0
3.5-4.8
(in mm)
c
c
Soldering Iron
Lead Wire of
Component to be
Connected Later.
Notice
in section
in section
C03E.pdf
61
10.5.20
3