GRM319F51H224ZA01D Murata, GRM319F51H224ZA01D Datasheet - Page 216

• Manufacturer Part Number: GRM319F51H224ZA01D
• Manufacturer: Murata

Specifications of GRM319F51H224ZA01D

• Tolerance (+ Or -): -20% to 80%
• Voltage: 50VDC
• Temp Coeff (dielectric): Y5V
• Operating Temp Range: -30C to 85C
• Mounting Style: Surface Mount
• Construction: SMT Chip
• Case Style: Ceramic Chip
• Failure Rate: Not Required
• Wire Form: Not Required
• Product Length (mm): 3.2mm
• Product Depth (mm): 1.6mm
• Product Height (mm): 0.85mm
• Product Diameter (mm): Not Requiredmm
• Capacitance: .22uF
• Package / Case: 1206
• Lead Free Status / RoHS Status: Compliant

18
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. Construction of Board Pattern
Construction and Dimensions of Pattern (Example)
Dimensions of Slit (Example)
214
Notice
Notice (Soldering and Mounting)
After installing chips, if solder is excessively applied to
the circuit board, mechanical stress will cause destruction
resistance characteristics to lower. To prevent this, be
extremely careful in determining shape and dimension
before designing the circuit board diagram.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Chip Capacitor
Chip Capacitor
Preparing slit helps flux cleaning and resin
coating on the back of the capacitor.
But, the length of slit design should be shorter
enough as much as possible to prevent the
mechanical damage in the capacitor.
The longer slit design might receive more
severe mechanical stress from the PCB.
Recommendable slit design is shown in the
Table.
c
b
a
d
e
Slit
Solder Resist
Solder Resist
Land
Land
L
L
W
W
Flow Soldering
Flow soldering : 3.2g1.6 or less available.
Reflow Soldering
1.6g0.8
2.0g1.25
3.2g1.6
1.6g0.8
2.0g1.25
3.2g1.6
3.2g2.5
4.5g2.0
4.5g3.2
5.7g2.8
5.7g5.0
1.6g0.8
2.0g1.25
3.2g1.6
3.2g2.5
4.5g2.0
4.5g3.2
5.7g2.8
5.7g5.0
LgW
LgW
LgW
0.6-1.0
1.0-1.2
2.2-2.6
0.6-0.8
1.0-1.2
2.2-2.4
2.0-2.4
2.8-3.4
2.8-3.4
4.0-4.6
4.0-4.6
1.0-2.0
1.0-2.0
1.0-2.8
1.0-2.8
1.0-4.0
1.0-4.0
a
d
a
-
-
0.8-0.9
0.9-1.0
1.0-1.1
0.6-0.7
0.6-0.7
0.8-0.9
1.0-1.2
1.2-1.4
1.2-1.4
1.4-1.6
1.4-1.6
3.2-3.7
4.1-4.6
3.6-4.1
4.8-5.3
4.4-4.9
6.6-7.1
(in mm)
b
b
e
-
-
Continued on the following page.
0.6-0.8
0.8-1.1
1.0-1.4
0.6-0.8
0.8-1.1
1.0-1.4
1.8-2.3
1.4-1.8
2.3-3.0
2.1-2.6
3.5-4.8
(in mm)
c
c
C02E.pdf
09.9.18