GRM319F51H224ZA01D Murata, GRM319F51H224ZA01D Datasheet - Page 155

• Manufacturer Part Number: GRM319F51H224ZA01D
• Manufacturer: Murata

Specifications of GRM319F51H224ZA01D

• Tolerance (+ Or -): -20% to 80%
• Voltage: 50VDC
• Temp Coeff (dielectric): Y5V
• Operating Temp Range: -30C to 85C
• Mounting Style: Surface Mount
• Construction: SMT Chip
• Case Style: Ceramic Chip
• Failure Rate: Not Required
• Wire Form: Not Required
• Product Length (mm): 3.2mm
• Product Depth (mm): 1.6mm
• Product Height (mm): 0.85mm
• Product Diameter (mm): Not Requiredmm
• Capacitance: .22uF
• Package / Case: 1206
• Lead Free Status / RoHS Status: Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. PCB Design
1. Notice for Pattern Forms
Pattern Forms
and Leaded Components
Placing Close to Chassis
of Leaded Components
Notice
after Chip Component
of Chip Components
Soldering and Mounting
1-1. Unlike leaded components, chip components are
1-2. It is possible for the chip to crack by the expansion
Lateral Mounting
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
susceptible to flexing stresses since they are
mounted directly on the substrate.
They are also more sensitive to mechanical and
thermal stresses than leaded components.
Excess solder fillet height can multiply these stresses
and cause chip cracking. When designing substrates,
take land patterns and dimensions into consideration
to eliminate the possibility of excess solder fillet
height.
and shrinkage of a metal board. Please contact us if
you want to use our ceramic capacitors on a metal
board such as Aluminum.
Placing
Placing
Electrode Pattern
Lead Wire
Solder (ground)
Prohibited
Chassis
Soldering Iron
Lead Wire
Solder Resist
Solder Resist
Solder Resist
Correct
Solder Resist
Continued on the following page.
Notice
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