HSDL-3005-028 Avago Technologies US Inc., HSDL-3005-028 Datasheet - Page 15

• Manufacturer Part Number: HSDL-3005-028
• Description: Infrared Transceivers 20cm 3V SIR plus R C Top View
• Manufacturer: Avago Technologies US Inc.

Specifications of HSDL-3005-028

• Wavelength: 885 nm, 875 nm
• Continual Data Transmission: 115.2 Kbit/s
• Transmission Distance: 50 cm
• Radiant Intensity: 20 mW/sr
• Half Intensity Angle Degrees: 30 deg
• Pulse Width: 2.3 us, 1.6 us
• Maximum Rise Time: 100 ns, 600 ns
• Maximum Fall Time: 100 ns, 600 ns
• Led Supply Voltage: 2.4 V to 4.5 V
• Operating Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 7.5 mm x 3.35 mm x 2.8 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

1.3 Adjacent Land Keepout and
Solder Mask Areas
Adjacent land keepout is the
maximum space occupied by the
unit relative to the land pattern.
There should be no other SMD
components within this area.
The minimum solder resist strip
width required to avoid solder
bridging adjacent pads is 0.2 mm.
It is recommended that two
fiducial crosses be placed at
mid-length of the pads for unit
alignment.
Note: Wet/Liquid Photo-
Imageable solder resist/mask is
recommended.
15
1.2 Recommended Metal
Solder Stencil Aperture
It is recommended that only a
0.152 mm (0.006 inch) or a 0.127
mm (0.005 inch) thick stencil be
used for solder paste printing.
This is to ensure adequate
printed solder paste volume and
no shorting. See the table below
the drawing for combinations of
metal stencil aperture and metal
stencil thickness that should be
used.
Aperture opening for shield pad
is 3.05 mm x 1.1 mm as per land
pattern.
Figure 10. Solder stencil aperture.
Stencil thickness, t (mm)
0.152 mm
0.127 mm
Figure 11. Adjacent land keepout and solder mask areas.
l
APERTURES AS PER
LAND DIMENSIONS
SOLDER MASK
0.2
10.1
UNITS: mm
Aperture size(mm)
length, l
2.60 0.05
3.00 0.05
w
3.85
3.0
t
width, w
0.55 0.05
0.55 0.05