HSDL-3020-021 Avago Technologies US Inc., HSDL-3020-021 Datasheet - Page 12

• Manufacturer Part Number: HSDL-3020-021
• Description: Infrared Transceivers Orion 2 FIR + RC
• Manufacturer: Avago Technologies US Inc.

Specifications of HSDL-3020-021

• Wavelength: 875 nm
• Continual Data Transmission: 4 Mbit/s
• Transmission Distance: 50 cm
• Radiant Intensity: 4 mW/sr
• Half Intensity Angle Degrees: 30 deg
• Pulse Width: 4 us, 1.6 us
• Maximum Rise Time: 40 ns, 600 ns
• Maximum Fall Time: 40 ns, 600 ns
• Led Supply Voltage: 0 V to 6.5 V
• Maximum Forward Current: 190 mA
• Operating Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 10.4 mm x 2.95 mm x 2.5 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Recommended Reflow Profile
12
Process Zone
Heat Up
Solder Paste Dry
Solder Reflow
Cool Down
The reflow profile is a straight-
line representation of a nominal
temperature profile for a
convective reflow solder
process. The temperature profile
is divided into four process
zones, each with different
DT/Dtime temperature change
rates. The DT/Dtime rates are
detailed in the above table. The
temperatures are measured at
the component to printed circuit
board connections.
In process zone P1, the PC
board and HSDL-3020
castellation pins are heated to a
temperature of 160 C to activate
the flux in the solder paste. The
temperature ramp up rate, R1, is
limited to 4 C per second to
allow for even heating of both
the PC board and HSDL-3020
castellations.
255
230
220
200
180
160
120
80
25
0
HEAT
R1
UP
P1
Symbol
P1, R1
P2, R2
P3, R3
P3, R4
P4, R5
50
SOLDER PASTE DRY
R2
P2
100
t-TIME (SECONDS)
Process zone P2 should be of
sufficient time duration (60 to
120 seconds) to dry the solder
paste. The temperature is raised
to a level just below the liquidus
point of the solder, usually
200 C (392 F).
Process zone P3 is the solder
reflow zone. In zone P3, the
temperature is quickly raised
above the liquidus point of
solder to 255 C (491 F) for
optimum results. The dwell time
above the liquidus point of
solder should be between 20 and
60 seconds. It usually takes
about 20 seconds to assure
proper coalescing of the solder
balls into liquid solder and the
formation of good solder
connections. Beyond a dwell
time of 60 seconds, the
intermetallic growth within the
DT
25 C to 160 C
160 C to 200 C
200 C to 255 C (260 C at 10 seconds max)
255 C to 200 C
200 C to 25 C
150
R3
MAX. 260 C
REFLOW
SOLDER
60 sec.
ABOVE
220 C
MAX.
P3
200
R4
DOWN
COOL
P4
R5
250
300
solder connections becomes
excessive, resulting in the
formation of weak and
unreliable connections. The
temperature is then rapidly
reduced to a point below the
solidus temperature of the
solder, usually 200 C (392 F), to
allow the solder within the
connections to freeze solid.
Process zone P4 is the cool
down after solder freeze. The
cool down rate, R5, from the
liquidus point of the solder to
25 C (77 F) should not exceed
6 C per second maximum. This
limitation is necessary to allow
the PC board and HSDL-3020
castellations to change
dimensions evenly, putting
minimal stresses on the HSDL-
3020 transceiver.
Maximum DT/Dtime
4 C/s
0.5 C/s
4 C/s
-6 C/s
-6 C/s