HSDL-3021-021 Avago Technologies US Inc., HSDL-3021-021 Datasheet - Page 11

• Manufacturer Part Number: HSDL-3021-021
• Description: Infrared Transceivers FIR + RC
• Manufacturer: Avago Technologies US Inc.

Specifications of HSDL-3021-021

• Wavelength: 885 nm
• Continual Data Transmission: 4 Mbit/s
• Transmission Distance: 50 cm
• Radiant Intensity: 4 mW/sr
• Half Intensity Angle Degrees: 30 deg
• Pulse Width: 4 us, 1.6 us
• Maximum Rise Time: 40 ns, 600 ns
• Maximum Fall Time: 40 ns, 600 ns
• Led Supply Voltage: 0 V to 6.5 V
• Operating Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 8 mm x 3 mm x 2.5 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

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HSDL-3021 Moisture Proof Packaging
All HSDL-3021 options are shipped in moisture
proof package. Once opened, moisture
absorption begins.
This part is compliant to JEDEC Level 4.
Figure 3. Baking conditions chart.
IS NECESSARY
NO BAKING
YES
PERFORM RECOMMENDED
PACKAGE IS OPENED
BAKING CONDITIONS
UNITS IN A SEALED
MOISTURE-PROOF
LESS THAN 30°C,
AND LESS THAN
THAN 72 HOURS
ENVIRONMENT
OPENED LESS
(UNSEALED)
PACKAGE IS
PACKAGE
60% RH
YES
NO
NO
Recommended Storage Conditions
Storage Temperature 10 C to 30 C
Relative Humidity
Time From Unsealing To Soldering
After removal from the bag, the
parts should be soldered within
three days if stored at the recom-
mended storage conditions. When
MBB (Moisture Barrier Bag) is
opened and the parts are exposed
to the recommended storage
conditions more than three days
but less than 15 days, the parts
must be baked before reflow to
prevent damage to the parts.
Note: Using the parts that are
exposed for more than 15 days is
not recommended.
Baking Conditions
Package
In reels
In bulk
Note: Baking should only be
done once.
Temp
100 C
125 C
60 C
Below 60% RH
Time
48 hours
4 hours
2 hours