B6TS-08NF Omron, B6TS-08NF Datasheet - Page 5

• Manufacturer Part Number: B6TS-08NF
• Description: Capacitance Touch Sensors Sensing IC
• Manufacturer: Omron
• Series: -r
• Type: Capacitiver

Specifications of B6TS-08NF

• Supply Voltage: - 0.3 V to 6.5 V
• Number Of Channels: 8
• Dimensions: 9 mm L x 9 mm W x 1.7 mm H
• Output Voltage: -0.3 V to Vsupply + 0.3 V
• Power Dissipation: 300 mW
• Temperature Range: - 20 C to + 85 C
• Termination Style: SMD/SMT
• Sensitivity: -
• Response Time: -
• Interface: SPI
• Channel Inputs: 8 Key
• Voltage - Supply: 4.5 V ~ 5.5 V
• Actuator Type: -
• Package / Case: 32-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

3. Recommended soldering Conditions
Recommended soldering conditions (Pb free)
4. Recommended wash conditions
5. Handling after mounting parts on PCB
6. Applied voltages and currents
(1) Reflow method (infrared light reflow and air reflow)
(2) Wave soldering method (called known as flow soldering or dip soldering)
(3) Soldering iron (manual soldering)
The wash conditions compliant to MIL-STD-883C are recommended.
When using rosin flux wash, check the following items:
When dividing a PCB on which ICs are mounted, do not apply any excessive force to the ICs. Otherwise, the internal
IC chips may be broken.
Temperature conditions for mounting the IC chip
When mounting the IC chip at a high temperature by using reflow soldering, the melting temperature of the solder
depends on the mounting board and paste adhesive materials of the mounting board and the paste adhesive.
Referring to the mounting temperature profile shown in the following figure, choose the optimum soldering
temperature within the profile.
Wave soldering method using Pb-free solder is not recommended.
Solder using a soldering iron for semiconductor devices under the following conditions:
(1) Do not apply to any pin any voltage or current that exceeds the absolute maximum ratings.
(2) Use the device within the recommended specifications to enhance the quality of the device.
(3) Do not apply any forward bias to any of the pins.
(4) Do not connect any output pin directly to power. If any output pin is directly connected to low-impedance
(1) Amount of contamination containing residual ions (or no ions)
(2) Administrative directions and regulations
(3) Melting resistance of parts
[Iron tip temperature]
[Soldering time]
Otherwise, excessive forward current may cause thermal breakdown of the IC.
power, the internal wiring may melt down or break thermally due to excessive current.
150 C
Figure 1 . Reflow Method - Temperature Profile
60 - 180 sec.
350±5 C
No longer than 5 sec/pin
200
o
C
3 C/sec. (max)
5
260 C (max)
255 C or higher for 20 sec. (max)
217 C or higher for 60 - 150 sec.
3713050-2A Ver.080123
6 C /sec. (max)
Time (sec.)