B32922C3224K EPCOS Inc, B32922C3224K Datasheet - Page 12

• Manufacturer Part Number: B32922C3224K
• Description: Film Cap 0,22UF 10% 305V MKP X2
• Manufacturer: EPCOS Inc

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In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100 C.
Caution:
Consult us first if you wish to embed uncoated types!
Please read Cautions and warnings and
Important notes at the end of this document.
Embedding of capacitors in finished assemblies
B32921C/D ... B32926C/D
X2 / 305 V AC
Page 12 of 18