B32922C3224K EPCOS Inc, B32922C3224K Datasheet - Page 10
![no-image](/images/manufacturer_photos/0/2/226/epcos_inc_sml.jpg)
B32922C3224K
Manufacturer Part Number
B32922C3224K
Description
Film Cap 0,22UF 10% 305V MKP X2
Manufacturer
EPCOS Inc
Datasheet
1.B32922C3224K.pdf
(18 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
B32922C3224K
Manufacturer:
MURATA
Quantity:
30 000
Company:
Part Number:
B32922C3224K000
Manufacturer:
ST
Quantity:
21 400
Company:
Part Number:
B32922C3224K189
Manufacturer:
EPCOS
Quantity:
24 000
Part Number:
B32922C3224K189
Manufacturer:
EPCOS/爱普科斯
Quantity:
20 000
Company:
Part Number:
B32922C3224K289
Manufacturer:
UNIHOM
Quantity:
30 000
Part Number:
B32922C3224K289Z1
Manufacturer:
EPCOS/爱普科斯
Quantity:
20 000
Company:
Part Number:
B32922C3224K786
Manufacturer:
IDT
Quantity:
229
Part Number:
B32922C3224KZ1
Manufacturer:
EPCOS/爱普科斯
Quantity:
20 000
1.3
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Uncoated capacitors
For uncoated MKT capacitors with lead spacings 10 mm (B32560/B32561) the following mea-
sures are recommended:
Please read Cautions and warnings and
Important notes at the end of this document.
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
Pre-heating with a maximum temperature of 110 C
Temperature inside the capacitor should not exceed the following limits:
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
pre-heating to not more than 110 C in the preheater phase
rapid cooling after soldering
MKP/MFP 110 C
MKT 160 C
General notes on soldering
B32921C/D ... B32926C/D
X2 / 305 V AC
max
. Long exposure to temperatures above this type-related temperature limit
Page 10 of 18