BLM18EG121SN1-D Murata, BLM18EG121SN1-D Datasheet - Page 176
![CHIP FERRITE BEAD, 0603, 2A](/photos/25/91/259141/4704680_sml.jpg)
BLM18EG121SN1-D
Manufacturer Part Number
BLM18EG121SN1-D
Description
CHIP FERRITE BEAD, 0603, 2A
Manufacturer
Murata
Series
BLM18EGr
Datasheet
1.BLM18EG121SN1-D.pdf
(209 pages)
Specifications of BLM18EG121SN1-D
Impedance
120ohm
Dc Resistance Max
0.04ohm
Dc Current Rating
2A
Ferrite Mounting
SMD
Ferrite Case Style
0603
No. Of Pins
2
Frequency Range
100MHz To 1GHz
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!Note
174
Chip Common Mode Choke Coil
<Operating Environment>
Do not use products in a chemical atmosphere such as
chlorine gas, acid or sulfide gas.
Do not use products in the environment close to the
organic solvent.
<Storage and Handling Requirements>
1. Storage Period
2. Storage Conditions
1. Cleaning
2. Soldering
3. Other
Do not use products beyond the rated current and rated
voltage as this may create excessive heat and
deteriorate the insulation resistance.
1. Self-heating
(1) Storage temperature: -10 to +40˚C
(2) Do not store products in a chemical atmosphere
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
Storage and Operating Conditions
Notice (Soldering and Mounting)
Please provide special attention when mounting chip
common mode choke coils DLW5 series in close
proximity to other products that radiate heat.
The heat generated by other products may deteriorate
the insulation resistance and cause excessive heat in
this component.
DLW11G/DLM2HG series should be used within 6
months, the other series should be used within 12
months.
Solderability should be checked if this period is
exceeded.
Failure and degradation of a product are caused by
the cleaning method. When you clean in conditions
that are not in mounting information, please contact
Murata engineering.
Reliability decreases with improper soldering methods.
Please solder by the standard soldering conditions
shown in mounting information.
Noise suppression levels resulting from Murata's EMI
suppression filters EMIFILr may vary, depending on
the circuits and ICs used, type of noise, mounting
pattern, mounting location, and other operating
conditions. Be sure to check and confirm in advance
the noise suppression effect of each filter, in actual
circuits, etc. before applying the filter in a commercial-
purpose equipment design.
Rating
Soldering and Mounting
Relative humidity: 15 to 85%
Avoid sudden changes in temperature and humidity.
such as chlorine gas, acid or sulfide gas.
!Caution/Notice
!Caution
Notice
2. Resin Coating (DLW Series)
3. Caution for Use (DLW Series)
4. Brushing
5. Handling of a Substrate
1. Resin Coating (Except DLW Series.)
2. Mounting Direction
to prevent breaking the core.
Bending
Mount Chip Common Mode Choke Coils in right
direction. Wrong direction, which is 90 degrees rotated
from right direction, causes not only open or short
circuit but also flames or other serious trouble.
Handling
Using resin for coating/molding products may affect
the products performance.
So please pay careful attention in selecting resin.
Prior to use, please make the reliability evaluation with
the product mounted in your application set.
The impedance value may change due to high cure-
stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress
caused by the resin, amount/cured shape of resin, or
operating condition etc. Some resin contains some
impurities or chloride possible to generate chlorine by
hydrolysis under some operating condition may cause
corrosion of wire of coil, leading to open circuit.
So, please pay your careful attention in selecting resin
in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no
reliability issue is observed by evaluating products
mounted on your board.
When you hold products with a tweezer, please hold
by the sides. Sharp materials, such as a pair of
tweezers, should not touch the winding portion to
prevent breaking the wire. Mechanical shock should
not be applied to the products mounted on the board
When you clean the neighborhood of products such
as connector pins, bristles of cleaning brush shall not
be touched to the winding portion of this product to
prevent the breaking of wire.
After mounting products on a substrate, do not apply
any stress to the product caused by bending or
twisting to the substrate when cropping the substrate,
inserting and removing a connector from the substrate
or tightening screw to the substrate. Excessive
mechanical stress may cause cracking in the Product.
right direction
Z
Twisting
wrong direction
Z
Mar.28,2011
C31E.pdf
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