BLM18EG121SN1-D Murata, BLM18EG121SN1-D Datasheet - Page 144

• Manufacturer Part Number: BLM18EG121SN1-D
• Description: CHIP FERRITE BEAD, 0603, 2A
• Manufacturer: Murata
• Series: BLM18EGr

Specifications of BLM18EG121SN1-D

• Impedance: 120ohm
• Dc Resistance Max: 0.04ohm
• Dc Current Rating: 2A
• Ferrite Mounting: SMD
• Ferrite Case Style: 0603
• No. Of Pins: 2
• Frequency Range: 100MHz To 1GHz

!Note
142
NFW31S
NFE31P
NFE61P
NFA
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
Series
oGuideline of solder paste thickness:
oGuideline of solder paste thickness:
oGuideline of solder paste thickness:
100-200 m: NFA31G/31C
100-150 m: NFA18S/21S
150-200 m
150-200 m
0.25
NFA21S
NFA18S
NFA31G/31C
0.175
0.5
0.05
Solder Paste Printing
0.3
1.5
0.25
1.375
1.3
2.0
0.4
1.5
4.8
8.8
0.5
2.6
0.6
2.2
4.2
0.225
0.8 Pitch
0.6
Apply 1.0mg of bonding agent at each chip.
NFW31S Series
Apply 0.2mg of bonding agent at each chip.
NFp Chip EMIFILr
Bonding agent
Bonding agent
Adhesive Application
Soldering and Mounting
Bonding agent
1.5
4.8
9.0
Coating positon of
bonding agent
(in mm)
Mar.28,2011
C31E.pdf