PRODUCT DESCRIPTION
3616™ provides the following product characteristics:
3616™ is designed for the bonding of surface mounted devices
to printed circuit boards prior to wave soldering. Particularly
suited to printing a range of dot heights with one stencil
thickness and where high wet strength characteristics, and
high print speeds are required.
TYPICAL PROPERTIES OF UNCURED MATERIAL
TYPICAL CURING PERFORMANCE
Recommended conditions for curing are exposure to heat
above 100 °C (typically 90-120 seconds @ 150 °C). Rate of
cure and final strength will depend on the residence time at the
cure temperature.
Cure Speed vs. Time, Temperature
The following graph shows the rate of torque strength
developed with time at different temperatures. These times are
defined from the moment the adhesive reaches cure
temperature. In practice, total oven time may be longer to allow
for heat up period. Strength is measured on 1206 capacitors @
22 °C, tested according to IPC SM817, TM-650 Method 2.4.42.
Technology
Chemical Type
Appearance (uncured)
Components
Cure
Application
Key Substrates
Other Application Areas Small parts bonding
Dispense Method
Wet Strength
Specific Gravity @ 25 °C
Yield Point, 25 °C, Pa
Casson Viscosity @ 25 °C, Pa∙s
Flash Point - See MSDS
Cone & Plate Rheometer:
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
Haake PK 100, M10/PK 1 2° Cone
100
75
50
25
0
0
1
2
3
Epoxy
Epoxy
Red viscous paste
One component - requires no mixing
Heat cure
Surface mount adhesive
SMD components to PCB
Stencil print
High
4
5
6
LMS
7
1.33
250 to 650
15 to 55
8
LMS
9
10
Isothermal DSC Conversion
TYPICAL PROPERTIES OF CURED MATERIAL
TYPICAL PERFORMANCE OF CURED MATERIAL
Bond strength achieved in practice will vary considerably
depending on the SMD component type, adhesive dot size
and the type, grade and degree of cure of the solder
mask/resist.
5 minutes @ 125 °C, %
Cured for 30 minutes @ 150 °C
Adhesive Properties
Cured for 30 minutes @ 150 °C
Cured for 5 minutes @ 125 °C
Cured for 3 minutes @ 150 °C
Physical Properties:
Electrical Properties:
Lap Shear Strength, ISO 4587:
Pull-off Strength, Siemens norm SN59651:
Torque Strength, IPC SM817 , TM-650 Method 2.4.42:
Push-off Strength:
Coefficient of Thermal Expansion,
Coefficient of Thermal Conductivity, ISO 8302,
W/(m·K)
Specific Heat, kJ/(kg·K)
Density, BS 5350-B1 @ 25 °C, g/cm³
Glass Transition Temperature ISO 11359-2, °C
Dielectric Constant / Dissipation Factor, IEC 60250:
Dielectric Breakdown Strength,
IEC 60243-1, kV/mm
Volume Resistivity, IEC 60093, Ω·cm
Surface Resistivity, IEC 60093, Ω
Surface Insulation Resistance, Ω:
Electrolytic Corrosion, DIN 53489
Steel (grit blasted)
C-1206 on bare FR4 board
C-1206 on bare FR4 board
C-1206 on bare FR4 board
ISO 11359-2, K
1-kHz
10-kHz
1,000-kHz
10,000-kHz
SN 59651
-1
Technical Data Sheet
N/mm² ≥15
(psi)
N
(lb)
N·mm
(in.oz)
N
(lb)
3616™
March-2008
95 to 100
(10.3)
(≥6.7)
86×10
0.2
0.3
1.3
140
33.5
4.6×10
28×10
A - 1.2
2.8 / 0.003
2.8 / 0.012
2.7 / 0.014
2.7 / 0.017
0.245×10
46
54
≥30
(≥2,175)
(7.6)
LMS
LMS
-6
15
15
LMS
12
