ICK S R 50 X 20 FISCHER ELEKTRONIK, ICK S R 50 X 20 Datasheet

ICK S R 50 X 20

Manufacturer Part Number

ICK S R 50 X 20

Description

HEAT SINK

Manufacturer

FISCHER ELEKTRONIK

Datasheet

1.ICK_S_R_50_X_20.pdf (1 pages)

Specifications of ICK S R 50 X 20

Thermal Resistance

8.55K/W

Height

20mm

Diameter

50mm

Mounting Type

Thermally Conductive Adhesive / Foil

For Use With

Processors

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

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Pin heatsinks /

Ø 50 x 20 mm, pin heatsinks round

Parameters of article ICK S R 50 x 20

Accessories/ related articles

Thermally conductive foil both sides adhesive / WLFT 404 D 50

Thermally conductive foil both sides adhesive / WLFT 405 D 50

Bauform

dissipation loss [W]

mounting method

socket

suitable for processor type universal

Ø [mm]

heigth [mm]

plate thickness [mm]

weight [g]

[K/W]

ICK S R 50 x 20

Rund

8.55

9.8

therm. conductive foil / therm. cond. adhesive

universal

34.39

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