ICK S 36 X 36 X 10 FISCHER ELEKTRONIK, ICK S 36 X 36 X 10 Datasheet
![HEAT SINK](/photos/23/70/237019/17t5914-30_sml.jpg)
ICK S 36 X 36 X 10
Manufacturer Part Number
ICK S 36 X 36 X 10
Description
HEAT SINK
Manufacturer
FISCHER ELEKTRONIK
Datasheet
1.ICK_S_36_X_36_X_10.pdf
(1 pages)
Specifications of ICK S 36 X 36 X 10
Thermal Resistance
4.7K/W
Width
36.4mm
Height
10mm
Length/height, External
10mm
External Width
36mm
Length
36.4mm
External Depth
36mm
Mounting Type
Thermally Conductive Adhesive / Foil
For Use With
Processors
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
M
G
H
N
A
D
K
B
C
E
F
L
I
H
H
H
H
Pin heatsinks
ICK S 36 x 36 x 10
WLF ... 36 x 36
weight: 17 g
ICK S 36 x 36 x 15
WLF ... 36 x 36
weight: 20 g
ICK S 36 x 36 x 20
WLF ... 36 x 36
weight: 24 g
ICK S 40 x 40 x 10
WLF ... 40 x 40
weight: 21 g
ICK S 40 x 40 x 20
WLF ... 40 x 40
weight: 29 g
ICK S 45 x 45 x 10
WLF ... 45 x 45
weight: 26 g
B 19
art. no.
art. no.
art. no.
art. no.
art. no.
art. no.
H
Thermal conduct. foil WLFT 404/405
Thermal conductive glue
Thermal conductive paste
Processor overview
E 5
E 14
E 12
B 2 - 7
Hola1
SMD-heatsinks
Mounting material for semiconduct.
Hole pattern
Technical introduction
B 25 – 27
E 34 – 38
A 21
A 2 - 7
H
H