628-25AB Wakefield Thermal Solutions, 628-25AB Datasheet

Heat Sink

628-25AB

Manufacturer Part Number
628-25AB
Description
Heat Sink
Manufacturer
Wakefield Thermal Solutions
Datasheet

Specifications of 628-25AB

Packages Cooled
PGA / LED
Width
43.2mm
Height
6.35mm
Length
44.5mm
Mounting Type
Adhesive
Package / Case
PGA
Color
Black
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
All other products, please contact factory for price, delivery, and minimums.
Dimensions: in. (mm)
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
MECHANICAL DIMENSIONS
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
P E N G U IN
Integrated Circuit
Heat Sinks
659 SERIES
Standard
P/N
659-65AB
Notes: 1. Optional factory preapplied pressure-sensitive adhesive. Pages 74–76.
655 SERIES
Standard
P/N
655-26AB
655-53AB
Notes: 1. Optional factory preapplied pressure-sensitive adhesive. Pages 74–76.
658 SERIES
Standard
P/N
658-25AB
658-35AB
658-45AB
658-60AB
Notes: 1. Optional factory preapplied pressure-sensitive adhesive. Pages 74–76.
COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs
1
1
Unidirectional Fin Heat Sink for AMD Am386
Pin Fin Heat Sinks for PowerPC™ 601, PowerPC™ 603
Omnidirectional Pin Fin Heat Sinks for IntelDX4™,
AMD Am29240™, PowerPC™ 603
Base Dimensions
1.600 (40.6) sq
1.600 (40.6) sq
in. (mm)
Base Dimensions
1.100 (27.9) sq
1.100 (27.9) sq
1.100 (27.9) sq
1.100 (27.9) sq
Base Dimensions
1.45 (36.8) sq
in. (mm)
in. (mm)
KEY:
658-25AB
1
Dimension “A”
0.525 (13.3)
0.260 (6.6)
in. (mm)
26
+
658-35AB
Dimension “A”
0.250 (6.4)
0.350 (8.9)
0.450 (8.9)
0.600 (8.9)
in. (mm)
0.650 (16.5)
®
in. (mm)
, PowerPC™ 601
Height
658-45AB
Dimension “B”
0.125 (3.2)
0.145 (3.7)
in. (mm)
658-60AB
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
Black Anodized
Black Anodized
Black Anodized
Black Anodized
Black Anodized
Heat Sink
NATURAL AND FORCED
NATURAL AND FORCED
POWERQUAD2™, 28-38 mm CQFP/MQUAD™
NATURAL AND FORCED
Heat Sink
Finish
Finish
Black Anodized
Black Anodized
Heat Sink
Finish
17 x 17 PGA, 32 mm CQFP
14 x 14, 38, 40 mm CQFP
40 mm CQFP
Normally stocked
0.050 (22.68)
0.038 (17.01)
0.050 (22.68)
0.031 (14.17)
lbs. (grams)
lbs. (grams)
lbs. (grams)
0.013 (5.67)
0.015 (6.70)
0.019 (8.50)
Weight
Weight
Weight

Related parts for 628-25AB

628-25AB Summary of contents

Page 1

Integrated Circuit Heat Sinks ™ COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs 659 SERIES Unidirectional Fin Heat Sink for AMD Am386 Standard P/N 659-65AB Notes: 1. Optional factory preapplied pressure-sensitive adhesive. Pages 74–76. ...

Page 2

PENGUIN ™ COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs 624 SERIES Omnidirectional Pin Fin Heat Sink for 21mm BGAs Standard P/N 624-25AB 624-35AB 624-45AB 624-60AB Material: Aluminum, Black Anodized The 624 Series is an omnidirectional pin fin heat sink ...

Page 3

Integrated Circuit Heat Sinks ™ COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs 660 SERIES Unidirectional Fin Heat Sink for PowerPC™ 603 Standard P/N 660-29AB Notes: 1. Optional factory preapplied pressure-sensitive adhesive. Pages 74–76. ...

Page 4

DELTEM ™ COMPOSITE HEAT SINKS FOR PQFPs, CQFPs, AND BGAs Deltem™ D10650-40 Pin Fin Heat Sink for 100-Lead PQFPs, 169 BGA Standard P/N D10650-40 Notes: Available with pressure sensitive adhesives for quick and easy mounting. Pages 74–76. Deltem™ D10850-40 Pin ...

Page 5

... A 486™DX4 M M Heat Sink Finish Black Anodized Black Anodized Black Anodized Black Anodized Black Anodized FORCED CONVECTION CHARACTERISTICS b 628-25AB 628-35AB 628-40AB 628-65AB Heat Sink Finish lbs. (grams)663 Black Anodized NATURAL AND FORCED CONVECTION CHARACTERISTICS Normally stocked PGA Weight lbs ...

Page 6

PENGUIN ™ COOLERS: HEAT SINKS FOR MICROPROCESSORS AND ASICs 609 SERIES Pin Fin Heat Sink/Clip Assembly for PowerPC™ 601, 604 (304 C4QFP, 255 CBGA Standard P/N 609-50AB 609-100AB Notes: 1. Optional factory preapplied thermal interface material. Pages 74–76. MECHANICAL DIMENSIONS ...

Related keywords