262-75ABE-05 Wakefield Thermal Solutions, 262-75ABE-05 Datasheet - Page 8

• Manufacturer Part Number: 262-75ABE-05
• Description: Board Level Heat Sinks For TO-220 & TO-218 & Multiwatt Components
• Manufacturer: Wakefield Thermal Solutions
• Series: 262r

Specifications of 262-75ABE-05

• Package Cooled: TO-220
• Attachment Method: Press Fit and PC Pin
• Outline: 14.48mm x 12.70mm
• Height: 0.750" (19.05mm)
• Power Dissipation @ Temperature Rise: 3W @ 80°C
• Thermal Resistance @ Forced Air Flow: 10.0°C/W @ 200 LFM
• Thermal Resistance @ Natural: 26.7°C/W
• Product: Heatsinks
• Mounting Style: Through Hole
• Heatsink Material: Aluminum
• Dimensions: 12.7 mm L x 14.5 mm W x 19.1 mm H
• Designed For: TO-220
• Color: Black
• Thermal Resistance: 10°C/W
• Width: 14.5mm
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 262-75AB-05; 26275AB05; 345-1085

WTS001_p26-49
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Material: Aluminum,
Black Anodized
MECHANICAL DIMENSIONS
6/14/07
240-118ABH-22
273-AB
274 SERIES
281 SERIES
10:55 AM
Standard
P/N
273-AB
273-ABE-01
273-ABE-02
Material: Aluminum, Black Anodized
Standard
P/N
274-1AB
274-1ABE-01
274-1ABE-02
274-2AB
274-2ABE-01
274-2ABE-02
274-3AB
274-3ABE-01
274-3ABE-02
281-1AB
281-2AB
Standard
P/N
240-118ABEH-22 1.180 (30.0)
240-118ABES-22 1.180 (30.0)
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
274 & 281 SERIES
273 SERIES
240 SERIES
Dimensions: in. (mm)
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
240-118ABS-22
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Height Above
Height Above
.375 (9.5)
.375 (9.5)
.375 (9.5)
.500 (12.7)
.500 (12.7)
.500 (12.7)
.250 (6.4)
.250 (6.4)
.250 (6.4)
.375 (9.5)
.500 (12.7)
.375 (9.5)
.375 (9.5)
.375 (9.5)
PC Board
PC Board
in. (mm)
in. (mm)
Height Above
PC Board
in. (mm)
Low-Cost, Low-Height Wavesolderable Heat Sinks
Labor-Saving Twisted Fin Heat Sinks
.750 (19.1) x .750 (19.1)
.750 (19.1) x .750 (19.1)
.750 (19.1) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
Low-Cost, Low-Height Wavesolderable Heat Sinks
1.000 (25.4) x .500 (12.7)
1.000 (25.4) x .500 (12.7)
273-AB-01
Dimensions
Dimensions
Footprint
Footprint
in. (mm)
in. (mm)
Dimensions
Footprint
in. (mm)
240 SERIES
Dimensions: in. (mm)
273 SERIES
274 SERIES
274-XAB-01
Configuration
Configuration
Vert./Horiz.
Vert./Horiz.
Vert./Horiz.
Vert./Horiz.
Mounting
Mounting
Configuration
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Mounting
Vertical
Vertical
273-AB-02
Tab Options
Tab Options
Solderable
Solderable
Tab Options
Solderable
No Tab
No Tab
No Tab
No Tab
No Tab
No Tab
01
02
01
02
01
02
01
02
22
22
274-XAB-02
Clip/Mtg Hole
Clip/Mtg Slot
Mounting
Mounting
Mounting
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Style
Style
Style
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
NATURAL AND FORCED
Convection
49°C @ 2W
49°C @ 2W
49°C @ 2W
Convection
56°C @ 2W
56°C @ 2W
56°C @ 2W
50°C @ 2W
50°C @ 2W
50°C @ 2W
62°C @ 2W
62°C @ 2W
62°C @ 2W
56°C @ 2W
50°C @ 2W
Convection
55°C @ 4W
55°C @ 4W
Thermal Performance at Typical Load
Thermal Performance at Typical Load
NATURAL AND FORCED
Thermal Performance at Typical Load
NATURAL AND FORCED
Natural
Natural
Natural
7.2°C/W @ 400 LFM
7.2°C/W @ 400 LFM
7.2°C/W @ 400 LFM
8.0°C/W @ 400 LFM
8.0°C/W @ 400 LFM
8.0°C/W @ 400 LFM
7.0°C/W @ 400 LFM
7.0°C/W @ 400 LFM
7.0°C/W @ 400 LFM
9.0°C/W @ 400 LFM
9.0°C/W @ 400 LFM
9.0°C/W @ 400 LFM
8.0°C/W @ 400 LFM
7.0°C/W @ 400 LFM
5.3°C/W @ 400 LFM
5.3°C/W @ 400 LFM
Board Level
Heat Sinks
Convection
Convection
Convection
Forced
Forced
Forced
TO-218, TO-220
TO-220
TO-220
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