262-75ABE-05 Wakefield Thermal Solutions, 262-75ABE-05 Datasheet - Page 2

• Manufacturer Part Number: 262-75ABE-05
• Description: Board Level Heat Sinks For TO-220 & TO-218 & Multiwatt Components
• Manufacturer: Wakefield Thermal Solutions
• Series: 262r

Specifications of 262-75ABE-05

• Package Cooled: TO-220
• Attachment Method: Press Fit and PC Pin
• Outline: 14.48mm x 12.70mm
• Height: 0.750" (19.05mm)
• Power Dissipation @ Temperature Rise: 3W @ 80°C
• Thermal Resistance @ Forced Air Flow: 10.0°C/W @ 200 LFM
• Thermal Resistance @ Natural: 26.7°C/W
• Product: Heatsinks
• Mounting Style: Through Hole
• Heatsink Material: Aluminum
• Dimensions: 12.7 mm L x 14.5 mm W x 19.1 mm H
• Designed For: TO-220
• Color: Black
• Thermal Resistance: 10°C/W
• Width: 14.5mm
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 262-75AB-05; 26275AB05; 345-1085

WTS001_p1-25
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
217 SERIES
MECHANICAL DIMENSIONS
Dimensions: in.
217 SERIES
TUBE: 16.25 Inches Long,
20 Pieces per Tube
6/14/07
MECHANICAL DIMENSIONS
Min. ESD Material with Nail
Stops
TUBE DETAILS
217-36CTT6
10:54 AM
218-40CT3
Surface Mount Heat Sinks
Standard
P/N
218-40CTE3
218-40CTE5
Material: Copper, Matte Tin Plated
218 SERIES
Page 23
REF: JEDEC TO-263 (DD PAK)
REF: JEDEC MO-169 (DD PAK)
Surface Mount Heat Sink
BOARD LAYOUT RECOMMENDATIONS
Height Above
PC Board
.40 (10.2)
.40 (10.2)
in. (mm)
218-40CT5
1.03 (26.2) x .50 (12.7)
.90 (22.9) x .315 (8.0)
Maximum
Footprint
in. (mm)
SOL 20
100
80
60
40
20
0
Solid line = 218-40CT5
0
0
200
200
CONVECTION CHARACTERISTICS
0.5
Natural Convection
62°C rise @ 2W
62°C rise @ 2W
HEAT DISSIPATED (WATTS)
NATURAL AND FORCED
AIR VELOCITY (LFM)
400
400
1.0
Thermal Performance at Typical Load
Dashed Line = 218-40CT3
600
600
1.5
800
800
2.0
217-36CT6
D
1000
1000
2.5
2
PAK, TO-220, SOL-20
Board Level
21°C/W @ 200LFM
21°C/W @ 200LFM
Forced Convection
25
20
15
10
5
0
Heat Sinks
SMT Devices
23