AMMP-6408-TR2G Avago Technologies US Inc., AMMP-6408-TR2G Datasheet - Page 2

• Manufacturer Part Number: AMMP-6408-TR2G
• Description: Power Amp, MMIC, 6-18GHz Pkg
• Manufacturer: Avago Technologies US Inc.

Specifications of AMMP-6408-TR2G

• Current - Supply: 650mA
• Frequency: 6GHz ~ 18GHz
• Gain: 18dB
• P1db: 28.5dBm
• Package / Case: 8-SMD
• Rf Type: LMDS, MMDS
• Test Frequency: 8GHz
• Voltage - Supply: 6V
• Manufacturer's Type: Power Amplifier
• Number Of Channels: 1
• Supply Current: 650@5VmA
• Frequency (max): 18GHz
• Operating Supply Voltage (max): 6V
• Package Type: SMT
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Noise Figure: -
• Lead Free Status / Rohs Status: Compliant

Absolute Maximum Ratings
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to this device. Functional operation at or near these
2. Dissipated power PD is in any combination of DC voltage, Drain Current, input power and power delivered to the load.
3. When operated at maximum PD with a base plate temperature of 85 qC, the median time to failure (MTTF) is significantly reduced.
4. These ratings apply to each individual FET. The operating channel temperature will directly affect the device MTTF. For maximum life, it is
DC Specifications/Physical Properties
Notes:
6. Assume SnPb soldering to an evaluation RF board at 80°C base plate temperatures. Worst case for the channel temperature is under the
Thermal Properties
2
Symbols
Vd-Vg
Vd
Vg
Id
PD
Pin
Tch
Tstg
Tmax
Symbol
I
V
R
T
Parameter
Maximum Power Dissipation
Thermal Resistance (Tjc)
Thermal Resistance (Tjc)
Under RF Drive
d
ch
Tjc
g
limitations will significantly reduce the lifetime of the device.
recommended that junction temperatures (Tj) be maintained at the lowest possible levels. See MTTF vs. Tchannel Temperature Table.
quiescent operation. At saturated output power, DC power consumption rises to 4.26 W with 1.14 W RF power delivered to load. Power
dissipation is 3.11 W and the temperature rise in the channel is 68.4°C. In this condition, the base plate temperature must be remained below
86.6°C to maintain maximum operating channel temperature below 155°C.
Parameters
Drain to Gate Voltage
Positive Supply Voltage
Gate Supply Voltage
Drain Current
Power Dissipation
CW Input Power
Operating Channel Temp
Storage Case Temp.
Maximum Assembly Temp (30 sec max)
Parameters and Test Conditions
Drain Supply Current (V
Gate Supply Operating Voltage (I
Thermal Resistance
Channel Temperature
[6]
Test Conditions
Tbaseplate = 85°C
Vd = 5V
Id = 650mA
PD = 3.25W
Tbaseplate = 75°C
Vd = 5V
Id = 892mA
Pout = 30dBm
Pd = 3.47W
Tbaseplate = 75°C
(Channel-to-Base Plate)
d
= 5 V, V
g
d(Q)
set for I
= 650 (mA))
Units
V
V
V
mA
W
dBm
qC
qC
qC
d
Typical)
Minimum
-2.5
Value
PD = 3.5W
Tchannel = 150°C
Tjc = 20°C/W
Tchannel = 140°C
Tjc = 20°C/W
Tchannel = 145°C
Units
mA
V
°C/W
°C
Maximum
8
5.5
0.5
TBD
3.5
20
+150
-65 to +155
+320
Value
650
-1.1
20
150.6
Notes
2
2 and 3
2
4