ABCU-5700RZ Avago Technologies US Inc., ABCU-5700RZ Datasheet - Page 4

• Manufacturer Part Number: ABCU-5700RZ
• Description: ROHS Gen2 Cuhead Module
• Manufacturer: Avago Technologies US Inc.

Specifications of ABCU-5700RZ

• Data Rate: 1.25Gbps
• Applications: Ethernet
• Voltage - Supply: 3.3V
• Connector Type: RJ45
• Mounting Type: SFP
• Data Rate Max: 1.25Gbps
• Supply Current: 350mA
• Supply Voltage: 3.3V
• Power Rating: 1.1W
• Peak Reflow Compatible (260 C): No
• Leaded Process Compatible: No
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Wavelength: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1976

Application Support
Evaluation Kit
To help you in your preliminary transceiver evaluation,
Avago Technologies offers a 1.25 GBd Gigabit Ethernet
evaluation board. This board will allow testing of the
electrical parameters of transceiver. Please contact your
local Field Sales representative for availability and
ordering details.
Reference Designs
Reference designs for the SFP transceiver and the
HDMP-1636A physical layer IC are available to assist
the equipment designer. Figure 4 depicts a typical
application configuration, while Figure 5 depicts the
MSA power supply filter circuit design. Please contact
your local Field Sales engineer for more information
regarding application tools.
Regulatory Compliance
See Table 1 for transceiver Regulatory Compliance
performance. The overall equipment design will
determine the certification level. The transceiver
performance is offered as a figure of merit to assist the
designer.
Table 1. Regulatory Compliance
4
Feature
Electrostatic Discharge (ESD)
Electrostatic Discharge (ESD)
Receptacle
Electromagnetic Interference
(EMI)
Radiated Immunity
Component Recognition
Grounding Configuration
ROHS Compliance
to the Electrical Pins
to the RJ 45 Connector
MIL-STD-883C Method 3015.4
FCC Part 15 Class B
CENELEC EN55022 Class B
(CISPR 22A)
Underwriters Laboratories and Canadian Standards
Information Technology Equipment Including
Electrical Business Equipment
DC short between signal and chassis grounds
Chemical composition analysis
Test Method
JEDEC/EIA JES022-A114-A
Variation of IEC 61000-4-2
VCCI Class 1
Variation of IEC 61000-4-3
Association Joint Component Recognition for
Electrostatic Discharge (ESD)
There are two conditions in which immunity to ESD
damage is important. Table 1 documents our immunity
to both of these conditions. The first condition is during
handling of the transceiver prior to insertion into the
transceiver port. To protect the transceiver, it is
important to use normal ESD handling precautions.
These precautions include using grounded wrist straps,
work benches, and floor mats in ESD controlled areas.
The ESD sensitivity of the ABCU-5700/5710RZ is
compatible with typical industry production
environments.
The second condition is static discharges to the exterior
of the host equipment chassis after installation. To the
extent that the RJ45 connector interface is exposed to
the outside of the host equipment chassis, it may be
subject to system-level ESD requirements. The ESD
performance of the ABCU-5700/5710RZ exceeds typical
industry standards.
Immunity
Equipment hosting the ABCU-5700/5710RZ modules
will be subjected to radio-frequency electromagnetic
fields in some environments. The transceivers have
excellent immunity to such fields due to their shielded
design.
Performance
Less than 0.1% lead, mercury, hexavalent chromium,
Class 2 (2000 Volts)
Typically withstand 15 KV ( Air Discharge), 8 KV
(Contact) without damage when the RJ 45 connector
receptacle is contacted by a Human Body Model probe.
System margins are dependent on customer board and
chassis design.
Typically shows a negligible effect from a 10 V/m field
swept from 80 to 1000 MHz applied to the transceiver
without a chassis enclosure.
UL File # E173874
- Meets all regulatory requirements as listed above.
- Compliant with system boards using multi-point
grounding scheme
polybrominated biphenyls, and polybrominated biphenyl
ethers by weight of homogeneous material. Exemption for
lead in high melting temperature solder applied to module
connector. Less than 0.01% cadmium by weight of
homogeneous material.