SI8435DB-T1-E1 Vishay, SI8435DB-T1-E1 Datasheet - Page 8

• Manufacturer Part Number: SI8435DB-T1-E1
• Description: P CH MOSFET, -20V, 10A, MICRO FOOT
• Manufacturer: Vishay
• Series: TrenchFET®r

Specifications of SI8435DB-T1-E1

• Transistor Polarity: P Channel
• Continuous Drain Current Id: -10A
• Drain Source Voltage Vds: -20V
• On Resistance Rds(on): 75mohm
• Rds(on) Test Voltage Vgs: 5V
• Threshold Voltage Vgs Typ: -1V
• Fet Type: MOSFET P-Channel, Metal Oxide
• Fet Feature: Standard
• Rds On (max) @ Id, Vgs: 41 mOhm @ 1A, 4.5V
• Drain To Source Voltage (vdss): 20V
• Current - Continuous Drain (id) @ 25° C: 10A
• Vgs(th) (max) @ Id: 1V @ 250µA
• Gate Charge (qg) @ Vgs: 35nC @ 5V
• Input Capacitance (ciss) @ Vds: 1600pF @ 10V
• Power - Max: 6.25W
• Mounting Type: Surface Mount
• Package / Case: 4-MICRO FOOT®CSP
• Configuration: Single Dual Drain
• Resistance Drain-source Rds (on): 0.041 Ohms
• Drain-source Breakdown Voltage: - 20 V
• Gate-source Breakdown Voltage: +/- 5 V
• Continuous Drain Current: 6.72 A
• Power Dissipation: 2.78 W
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 55 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: SI8435DB-T1-E1TR

Johnson Zhao
INTRODUCTION
Vishay Siliconix’s MICRO FOOT product family is based on a
wafer-level chip-scale packaging (WL-CSP) technology that
implements a solder bump process to eliminate the need for an
outer package to encase the silicon die. MICRO FOOT
products include power MOSFETs, analog switches, and
power ICs.
For battery powered compact devices, this new packaging
technology reduces board space requirements, improves
thermal performance, and mitigates the parasitic effect typical
of leaded packaged products. For example, the 6−bump
MICRO FOOT Si8902EDB common drain power MOSFET,
which measures just 1.6 mm x 2.4 mm, achieves the same
performance as TSSOP−8 devices in a footprint that is 80%
smaller and with a 50% lower height profile (Figure 1). A
MICRO FOOT analog switch, the 6−bump DG3000DB, offers
low charge injection and 1.4 W on−resistance in a footprint
measuring just 1.08 mm x 1.58 mm (Figure 2).
Vishay Siliconix MICRO FOOT products can be handled with
the same process techniques used for high-volume assembly
of packaged surface-mount devices. With proper attention to
PCB and stencil design, the device will achieve reliable
performance without underfill. The advantage of the device’s
small footprint and short thermal path make it an ideal option
for space-constrained applications in portable devices such as
battery packs, PDAs, cellular phones, and notebook
computers.
This application note discusses the mechanical design and
reliability of MICRO FOOT, and then provides guidelines for
board layout, the assembly process, and the PCB rework
process.
Document Number: 71990
06-Jan-03
PCB Design and Assembly Guidelines
For MICRO FOOTr Products
FIGURE 1. 3D View of MICRO FOOT Products Si8902DB and
0.18 ~ 0.25
0.285
0.5
FIGURE 2. Outline of MICRO FOOT CSP & Analog
Si8900EDB
0.285
Switch DG3000DB
3
0.5
1.58
2
Vishay Siliconix
1
www.vishay.com
AN824
A
B
1.08
1